Inventor

EBE MASAYOSHI

JP3 patents

⚠️ This page may combine multiple inventors who share the name “EBE MASAYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKO ELECTRIC IND CO

1 patent

US5858816AJan 12, 1999

Method for producing circuit board, for semiconductor package, having cavity for accommodating semiconductor element

SHINKO ELECTRIC IND CO40 citations90

TAKEUCHI HIROKAZU

1 patent

US8153900B2Apr 10, 2012

Wiring substrate with lead pin and lead pin

TAKEUCHI HIROKAZU10 citations79

AOKI TOSHIAKI

1 patent

US8331101B2Dec 11, 2012

Chip component mounted wiring board

AOKI TOSHIAKI6 citations69