P

Inventor

LENZ ERIC H

US48 patents
⚠️ This page may combine multiple inventors who share the name “LENZ ERIC H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

40 patents
US6305677B1Oct 23, 2001

Perimeter wafer lifting

LAM RES CORP122 citations99
US7708859B2May 4, 2010

Gas distribution system having fast gas switching capabilities

LAM RES CORP268 citations98
US6389677B1May 21, 2002

Perimeter wafer lifting

LAM RES CORP98 citations98
US6019060AFeb 1, 2000

Cam-based arrangement for positioning confinement rings in a plasma processing chamber

LAM RES CORP136 citations98
US5998932ADec 7, 1999

Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber

LAM RES CORP123 citations98
US5074456ADec 24, 1991

Composite electrode for plasma processes

LAM RES CORP453 citations97
US7732728B2Jun 8, 2010

Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor

LAM RES CORP52 citations96
US7252738B2Aug 7, 2007

Apparatus for reducing polymer deposition on a substrate and substrate support

LAM RES CORP60 citations96
US7094315B2Aug 22, 2006

Chamber configuration for confining a plasma

LAM RES CORP46 citations96
US6872281B1Mar 29, 2005

Chamber configuration for confining a plasma

LAM RES CORP66 citations96
US6716762B1Apr 6, 2004

Plasma confinement by use of preferred RF return path

LAM RES CORP39 citations96
US6602381B1Aug 5, 2003

Plasma confinement by use of preferred RF return path

LAM RES CORP49 citations96
US6363882B1Apr 2, 2002

Lower electrode design for higher uniformity

LAM RES CORP57 citations96
US6239403B1May 29, 2001

Power segmented electrode

LAM RES CORP102 citations96
US6042686AMar 28, 2000

Power segmented electrode

LAM RES CORP117 citations96
US5609720AMar 11, 1997

Thermal control of semiconductor wafer during reactive ion etching

LAM RES CORP90 citations94
US5472565ADec 5, 1995

Topology induced plasma enhancement for etched uniformity improvement

LAM RES CORP53 citations94
US6838012B2Jan 4, 2005

Methods for etching dielectric materials

LAM RES CORP36 citations93
US5933314AAug 3, 1999

Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks

LAM RES CORP98 citations93
US6863784B2Mar 8, 2005

Linear drive system for use in a plasma processing system

LAM RES CORP15 citations92
US6669811B2Dec 30, 2003

Linear drive system for use in a plasma processing system

LAM RES CORP20 citations92
US5569356AOct 29, 1996

Electrode clamping assembly and method for assembly and use thereof

LAM RES CORP183 citations92
US5534110AJul 9, 1996

Shadow clamp

LAM RES CORP34 citations89
US7524397B2Apr 28, 2009

Lower electrode design for higher uniformity

LAM RES CORP9 citations84
US7455748B2Nov 25, 2008

Magnetic enhancement for mechanical confinement of plasma

LAM RES CORP9 citations84
US8343876B2Jan 1, 2013

Fast gas switching plasma processing apparatus

LAM RES CORP10 citations83
US7867356B2Jan 11, 2011

Apparatus for reducing polymer deposition on a substrate and substrate support

LAM RES CORP15 citations82
US7093560B2Aug 22, 2006

Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system

LAM RES CORP15 citations82
US10087523B2Oct 2, 2018

Vapor delivery method and apparatus for solid and liquid precursors

LAM RES CORP5 citations73
US9951423B2Apr 24, 2018

Systems and methods for measuring entrained vapor

LAM RES CORP6 citations73
US9234775B2Jan 12, 2016

Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber

LAM RES CORP6 citations72
US7838086B2Nov 23, 2010

Magnetic enhancement for mechanical confinement of plasma

LAM RES CORP3 citations63
US12476143B2Nov 18, 2025

Backside reactive inhibition gas

LAM RES CORP0 citations61
USRE41266EApr 27, 2010

Composite electrode for plasma processes

LAM RES CORP3 citations61
US12203168B2Jan 21, 2025

Metal deposition

LAM RES CORP1 citations60
US6536777B2Mar 25, 2003

Sealing techniques suitable for different geometries and constrained spaces

LAM RES CORP2 citations60
US9321000B2Apr 26, 2016

Airflow management for low particulate count in a process tool

LAM RES CORP0 citations52
US12531210B2Jan 20, 2026

Edge exclusion control

LAM RES CORP0 citations46
US12435418B2Oct 7, 2025

Removable showerhead faceplate for semiconductor processing tools

LAM RES CORP0 citations45
US10186448B2Jan 22, 2019

Wafer support pedestal with wafer anti-slip and anti-rotation features

LAM RES CORP0 citations40

LENZ ERIC H

5 patents

DHINDSA RAJINDER

1 patent

HUANG ZHISONG

1 patent

TONG JOSE

1 patent