Inventor
LENZ ERIC H
US48 patents
⚠️ This page may combine multiple inventors who share the name “LENZ ERIC H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
40 patentsUS6305677B1Oct 23, 2001
Perimeter wafer lifting
LAM RES CORP122 citations99
US7708859B2May 4, 2010
Gas distribution system having fast gas switching capabilities
LAM RES CORP268 citations98
US6389677B1May 21, 2002
Perimeter wafer lifting
LAM RES CORP98 citations98
US6019060AFeb 1, 2000
Cam-based arrangement for positioning confinement rings in a plasma processing chamber
LAM RES CORP136 citations98
US5998932ADec 7, 1999
Focus ring arrangement for substantially eliminating unconfined plasma in a plasma processing chamber
LAM RES CORP123 citations98
US5074456ADec 24, 1991
Composite electrode for plasma processes
LAM RES CORP453 citations97
US7732728B2Jun 8, 2010
Apparatuses for adjusting electrode gap in capacitively-coupled RF plasma reactor
LAM RES CORP52 citations96
US7252738B2Aug 7, 2007
Apparatus for reducing polymer deposition on a substrate and substrate support
LAM RES CORP60 citations96
US7094315B2Aug 22, 2006
Chamber configuration for confining a plasma
LAM RES CORP46 citations96
US6872281B1Mar 29, 2005
Chamber configuration for confining a plasma
LAM RES CORP66 citations96
US6716762B1Apr 6, 2004
Plasma confinement by use of preferred RF return path
LAM RES CORP39 citations96
US6602381B1Aug 5, 2003
Plasma confinement by use of preferred RF return path
LAM RES CORP49 citations96
US6363882B1Apr 2, 2002
Lower electrode design for higher uniformity
LAM RES CORP57 citations96
US6239403B1May 29, 2001
Power segmented electrode
LAM RES CORP102 citations96
US6042686AMar 28, 2000
Power segmented electrode
LAM RES CORP117 citations96
US5609720AMar 11, 1997
Thermal control of semiconductor wafer during reactive ion etching
LAM RES CORP90 citations94
US5472565ADec 5, 1995
Topology induced plasma enhancement for etched uniformity improvement
LAM RES CORP53 citations94
US6838012B2Jan 4, 2005
Methods for etching dielectric materials
LAM RES CORP36 citations93
US5933314AAug 3, 1999
Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks
LAM RES CORP98 citations93
US6863784B2Mar 8, 2005
Linear drive system for use in a plasma processing system
LAM RES CORP15 citations92
US6669811B2Dec 30, 2003
Linear drive system for use in a plasma processing system
LAM RES CORP20 citations92
US5569356AOct 29, 1996
Electrode clamping assembly and method for assembly and use thereof
LAM RES CORP183 citations92
US5534110AJul 9, 1996
Shadow clamp
LAM RES CORP34 citations89
US7524397B2Apr 28, 2009
Lower electrode design for higher uniformity
LAM RES CORP9 citations84
US7455748B2Nov 25, 2008
Magnetic enhancement for mechanical confinement of plasma
LAM RES CORP9 citations84
US8343876B2Jan 1, 2013
Fast gas switching plasma processing apparatus
LAM RES CORP10 citations83
US7867356B2Jan 11, 2011
Apparatus for reducing polymer deposition on a substrate and substrate support
LAM RES CORP15 citations82
US7093560B2Aug 22, 2006
Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
LAM RES CORP15 citations82
US10087523B2Oct 2, 2018
Vapor delivery method and apparatus for solid and liquid precursors
LAM RES CORP5 citations73
US9951423B2Apr 24, 2018
Systems and methods for measuring entrained vapor
LAM RES CORP6 citations73
US9234775B2Jan 12, 2016
Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber
LAM RES CORP6 citations72
US7838086B2Nov 23, 2010
Magnetic enhancement for mechanical confinement of plasma
LAM RES CORP3 citations63
US12476143B2Nov 18, 2025
Backside reactive inhibition gas
LAM RES CORP0 citations61
USRE41266EApr 27, 2010
Composite electrode for plasma processes
LAM RES CORP3 citations61
US12203168B2Jan 21, 2025
Metal deposition
LAM RES CORP1 citations60
US6536777B2Mar 25, 2003
Sealing techniques suitable for different geometries and constrained spaces
LAM RES CORP2 citations60
US9321000B2Apr 26, 2016
Airflow management for low particulate count in a process tool
LAM RES CORP0 citations52
US12531210B2Jan 20, 2026
Edge exclusion control
LAM RES CORP0 citations46
US12435418B2Oct 7, 2025
Removable showerhead faceplate for semiconductor processing tools
LAM RES CORP0 citations45
US10186448B2Jan 22, 2019
Wafer support pedestal with wafer anti-slip and anti-rotation features
LAM RES CORP0 citations40
LENZ ERIC H
5 patentsUS8562272B2Oct 22, 2013
Substrate load and unload mechanisms for high throughput
LENZ ERIC H450 citations98
US8282698B2Oct 9, 2012
Reduction of particle contamination produced by moving mechanisms in a process tool
LENZ ERIC H10 citations84
USRE43508EJul 17, 2012
Plasma confinement by use of preferred RF return path
LENZ ERIC H1 citations62
US8893642B2Nov 25, 2014
Airflow management for low particulate count in a process tool
LENZ ERIC H0 citations52
US9117870B2Aug 25, 2015
High throughput cleaner chamber
LENZ ERIC H0 citations41