Inventor
KRYWANCZYK TIMOTHY C
US29 patents
⚠️ This page may combine multiple inventors who share the name “KRYWANCZYK TIMOTHY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
25 patentsUS6294105B1Sep 25, 2001
Chemical mechanical polishing slurry and method for polishing metal/oxide layers
IBM22 citations92
US6340601B1Jan 22, 2002
Method for reworking copper metallurgy in semiconductor devices
IBM26 citations87
US7932614B2Apr 26, 2011
Method of thinning a semiconductor substrate
IBM12 citations83
US7867876B2Jan 11, 2011
Method of thinning a semiconductor substrate
IBM7 citations83
US6888223B2May 3, 2005
Use of photoresist in substrate vias during backside grind
IBM14 citations81
US6599173B1Jul 29, 2003
Method to prevent leaving residual metal in CMP process of metal interconnect
IBM14 citations81
US7387911B2Jun 17, 2008
Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
IBM10 citations80
US7025891B2Apr 11, 2006
Method of polishing C4 molybdenum masks to remove molybdenum peaks
IBM13 citations80
US7135124B2Nov 14, 2006
Method for thinning wafers that have contact bumps
IBM6 citations74
US6284151B1Sep 4, 2001
Chemical mechanical polishing slurry for tungsten
IBM11 citations74
US6355565B2Mar 12, 2002
Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers
IBM5 citations73
US7722446B2May 25, 2010
System and device for thinning wafers that have contact bumps
IBM3 citations63
US7987591B2Aug 2, 2011
Method of forming silicon chicklet pedestal
IBM1 citations62
US7498236B2Mar 3, 2009
Silicon wafer thinning end point method
IBM3 citations62
US7771560B2Aug 10, 2010
Methods to prevent ECC (edge chipping and cracking) damage during die picking process
IBM2 citations61
US7074715B2Jul 11, 2006
Use of photoresist in substrate vias during backside grind
IBM5 citations60
US7348216B2Mar 25, 2008
Rework process for removing residual UV adhesive from C4 wafer surfaces
IBM3 citations58
US7572739B2Aug 11, 2009
Tape removal in semiconductor structure fabrication
IBM2 citations57
US7001827B2Feb 21, 2006
Semiconductor wafer front side protection
IBM3 citations57
US6455434B1Sep 24, 2002
Prevention of slurry build-up within wafer topography during polishing
IBM2 citations55
US7844099B2Nov 30, 2010
Inspection method for protecting image sensor devices with front surface protection
IBM1 citations49
US7855130B2Dec 21, 2010
Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations
IBM0 citations48
US7902682B2Mar 8, 2011
Ultraviolet energy curable tape and method of making a semiconductor chip using the tape
IBM1 citations47
US7288465B2Oct 30, 2007
Semiconductor wafer front side protection
IBM1 citations46
US8034718B2Oct 11, 2011
Method to recover patterned semiconductor wafers for rework
IBM0 citations44