P

Inventor

DAVID LAWRENCE D

US31 patents
⚠️ This page may combine multiple inventors who share the name “DAVID LAWRENCE D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

19 patents
US4954142ASep 4, 1990

Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor

IBM330 citations98
US6015505AJan 18, 2000

Process improvements for titanium-tungsten etching in the presence of electroplated C4's

IBM88 citations97
US5094769AMar 10, 1992

Compliant thermally conductive compound

IBM76 citations96
US4747907AMay 31, 1988

Metal etching process with etch rate enhancement

IBM59 citations96
US6294105B1Sep 25, 2001

Chemical mechanical polishing slurry and method for polishing metal/oxide layers

IBM22 citations92
US6130170AOct 10, 2000

Process improvements for titanium-tungsten etching in the presence of electroplated C4's

IBM36 citations92
US5213704AMay 25, 1993

Process for making a compliant thermally conductive compound

IBM26 citations92
US4995942AFeb 26, 1991

Effective near neutral pH etching solution for molybdenum or tungsten

IBM25 citations92
US4898842AFeb 6, 1990

Organometallic-derived cordierite and other compounds comprising oxides of silicon

IBM38 citations92
US4798701AJan 17, 1989

Method of synthesizing amorphous group IIIA-group VA compounds

IBM49 citations92
US5135595AAug 4, 1992

Process for fabricating a low dielectric composite substrate

IBM24 citations91
US5518131AMay 21, 1996

Etching molydbenum with ferric sulfate and ferric ammonium sulfate

IBM22 citations89
US5277725AJan 11, 1994

Process for fabricating a low dielectric composite substrate

IBM17 citations81
US6284151B1Sep 4, 2001

Chemical mechanical polishing slurry for tungsten

IBM11 citations74
US6355565B2Mar 12, 2002

Chemical-mechanical-polishing slurry and method for polishing metal/oxide layers

IBM5 citations73
US5525761AJun 11, 1996

Copper-based paste containing refractory metal additions for densification control

IBM7 citations73
US5512711AApr 30, 1996

Copper-based paste containing refractory metal additions for densification control

IBM6 citations73
US6221269B1Apr 24, 2001

Method of etching molybdenum metal from substrates

IBM7 citations72
US4701314AOct 20, 1987

Method of producing microsized amorphous particles of metal phosphate

IBM3 citations63

CELANESE CORP

8 patents

CHEMFAB CORP

2 patents

WISCONSIN ALUMNI RES FOUND

1 patent

PISCES PRINT IMAGING SCIENCES

1 patent