Inventor
LIN YIXING
US17 patents
⚠️ This page may combine multiple inventors who share the name “LIN YIXING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
16 patentsUS6565984B1May 20, 2003
Clean aluminum alloy for semiconductor processing equipment
APPLIED MATERIALS INC70 citations94
US6713188B2Mar 30, 2004
Clean aluminum alloy for semiconductor processing equipment
APPLIED MATERIALS INC27 citations92
US6659331B2Dec 9, 2003
Plasma-resistant, welded aluminum structures for use in semiconductor apparatus
APPLIED MATERIALS INC30 citations92
US7910218B2Mar 22, 2011
Cleaning and refurbishing chamber components having metal coatings
APPLIED MATERIALS INC25 citations90
US7579067B2Aug 25, 2009
Process chamber component with layered coating and method
APPLIED MATERIALS INC18 citations90
US8021743B2Sep 20, 2011
Process chamber component with layered coating and method
APPLIED MATERIALS INC17 citations87
US7048814B2May 23, 2006
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus
APPLIED MATERIALS INC16 citations83
US7033447B2Apr 25, 2006
Halogen-resistant, anodized aluminum for use in semiconductor processing apparatus
APPLIED MATERIALS INC8 citations73
US10583465B2Mar 10, 2020
30 nm in-line LPC testing and cleaning of semiconductor processing equipment
APPLIED MATERIALS INC4 citations70
US11866821B2Jan 9, 2024
Substrate support cover for high-temperature corrosive environment
APPLIED MATERIALS INC2 citations69
US7055732B2Jun 6, 2006
Semiconductor processing apparatus including plasma-resistant, welded aluminum structures
APPLIED MATERIALS INC4 citations62
US10233554B2Mar 19, 2019
Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
APPLIED MATERIALS INC1 citations59
US12572770B2Mar 10, 2026
Tracking system on matrix two-dimensional code labels
APPLIED MATERIALS INC0 citations57
US11047035B2Jun 29, 2021
Protective yttria coating for semiconductor equipment parts
APPLIED MATERIALS INC1 citations56
US10253406B2Apr 9, 2019
Method for forming yttrium oxide on semiconductor processing equipment
APPLIED MATERIALS INC0 citations49
US11898245B2Feb 13, 2024
High throughput and metal contamination control oven for chamber component cleaning process
APPLIED MATERIALS INC0 citations44