Inventor
MOK SAMMY
US23 patents
⚠️ This page may combine multiple inventors who share the name “MOK SAMMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NANONEXUS INC
16 patentsUS6815961B2Nov 9, 2004
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
NANONEXUS INC113 citations99
US6812718B1Nov 2, 2004
Massively parallel interface for electronic circuits
NANONEXUS INC175 citations99
US6799976B1Oct 5, 2004
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
NANONEXUS INC92 citations98
US6791171B2Sep 14, 2004
Systems for testing and packaging integrated circuits
NANONEXUS INC125 citations98
US7621761B2Nov 24, 2009
Systems for testing and packaging integrated circuits
NANONEXUS INC83 citations96
US7247035B2Jul 24, 2007
Enhanced stress metal spring contactor
NANONEXUS INC61 citations96
US7009412B2Mar 7, 2006
Massively parallel interface for electronic circuit
NANONEXUS INC62 citations96
US6917525B2Jul 12, 2005
Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
NANONEXUS INC180 citations96
US7579848B2Aug 25, 2009
High density interconnect system for IC packages and interconnect assemblies
NANONEXUS INC72 citations95
US7382142B2Jun 3, 2008
High density interconnect system having rapid fabrication cycle
NANONEXUS INC43 citations93
US7138818B2Nov 21, 2006
Massively parallel interface for electronic circuit
NANONEXUS INC13 citations92
US7126358B2Oct 24, 2006
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
NANONEXUS INC13 citations92
US7126220B2Oct 24, 2006
Miniaturized contact spring
NANONEXUS INC40 citations89
US7137830B2Nov 21, 2006
Miniaturized contact spring
NANONEXUS INC14 citations81
US6710609B2Mar 23, 2004
Mosaic decal probe
NANONEXUS INC8 citations68
US7772860B2Aug 10, 2010
Massively parallel interface for electronic circuit
NANONEXUS INC1 citations63
VERIGY PTE LTD SINGAPORE
4 patentsUS7872482B2Jan 18, 2011
High density interconnect system having rapid fabrication cycle
VERIGY PTE LTD SINGAPORE21 citations90
US7952373B2May 31, 2011
Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
VERIGY PTE LTD SINGAPORE17 citations84
US7884634B2Feb 8, 2011
High density interconnect system having rapid fabrication cycle
VERIGY PTE LTD SINGAPORE2 citations60
US7812626B2Oct 12, 2010
High density interconnect system for IC packages and interconnect assemblies
VERIGY PTE LTD SINGAPORE5 citations60