Inventor
DOMINGUEZ JUAN E
US23 patents
⚠️ This page may combine multiple inventors who share the name “DOMINGUEZ JUAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
19 patentsUS7964174B2Jun 21, 2011
Nanotube growth and device formation
INTEL CORP29 citations92
US7682891B2Mar 23, 2010
Tunable gate electrode work function material for transistor applications
INTEL CORP19 citations92
US7687911B2Mar 30, 2010
Silicon-alloy based barrier layers for integrated circuit metal interconnects
INTEL CORP8 citations84
US7635503B2Dec 22, 2009
Composite metal films and carbon nanotube fabrication
INTEL CORP16 citations84
US7459392B2Dec 2, 2008
Noble metal barrier and seed layer for semiconductors
INTEL CORP12 citations84
US7354849B2Apr 8, 2008
Catalytically enhanced atomic layer deposition process
INTEL CORP13 citations83
US11145632B2Oct 12, 2021
High density die package configuration on system boards
INTEL CORP3 citations68
US7625817B2Dec 1, 2009
Method of fabricating a carbon nanotube interconnect structures
INTEL CORP4 citations63
US7858525B2Dec 28, 2010
Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill
INTEL CORP5 citations62
US7749906B2Jul 6, 2010
Using unstable nitrides to form semiconductor structures
INTEL CORP3 citations62
US7550385B2Jun 23, 2009
Amine-free deposition of metal-nitride films
INTEL CORP6 citations62
US7476615B2Jan 13, 2009
Deposition process for iodine-doped ruthenium barrier layers
INTEL CORP3 citations62
US7435679B2Oct 14, 2008
Alloyed underlayer for microelectronic interconnects
INTEL CORP2 citations62
US7507521B2Mar 24, 2009
Silicon based optically degraded arc for lithographic patterning
INTEL CORP2 citations57
US11817438B2Nov 14, 2023
System in package with interconnected modules
INTEL CORP0 citations51
US8344352B2Jan 1, 2013
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US7982204B2Jul 19, 2011
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US7704895B2Apr 27, 2010
Deposition method for high-k dielectric materials
INTEL CORP1 citations51
US7687225B2Mar 30, 2010
Optical coatings
INTEL CORP1 citations47