P

Inventor

DOMINGUEZ JUAN E

US23 patents
⚠️ This page may combine multiple inventors who share the name “DOMINGUEZ JUAN E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

19 patents
US7964174B2Jun 21, 2011

Nanotube growth and device formation

INTEL CORP29 citations92
US7682891B2Mar 23, 2010

Tunable gate electrode work function material for transistor applications

INTEL CORP19 citations92
US7687911B2Mar 30, 2010

Silicon-alloy based barrier layers for integrated circuit metal interconnects

INTEL CORP8 citations84
US7635503B2Dec 22, 2009

Composite metal films and carbon nanotube fabrication

INTEL CORP16 citations84
US7459392B2Dec 2, 2008

Noble metal barrier and seed layer for semiconductors

INTEL CORP12 citations84
US7354849B2Apr 8, 2008

Catalytically enhanced atomic layer deposition process

INTEL CORP13 citations83
US11145632B2Oct 12, 2021

High density die package configuration on system boards

INTEL CORP3 citations68
US7625817B2Dec 1, 2009

Method of fabricating a carbon nanotube interconnect structures

INTEL CORP4 citations63
US7858525B2Dec 28, 2010

Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill

INTEL CORP5 citations62
US7749906B2Jul 6, 2010

Using unstable nitrides to form semiconductor structures

INTEL CORP3 citations62
US7550385B2Jun 23, 2009

Amine-free deposition of metal-nitride films

INTEL CORP6 citations62
US7476615B2Jan 13, 2009

Deposition process for iodine-doped ruthenium barrier layers

INTEL CORP3 citations62
US7435679B2Oct 14, 2008

Alloyed underlayer for microelectronic interconnects

INTEL CORP2 citations62
US7507521B2Mar 24, 2009

Silicon based optically degraded arc for lithographic patterning

INTEL CORP2 citations57
US11817438B2Nov 14, 2023

System in package with interconnected modules

INTEL CORP0 citations51
US8344352B2Jan 1, 2013

Using unstable nitrides to form semiconductor structures

INTEL CORP0 citations51
US7982204B2Jul 19, 2011

Using unstable nitrides to form semiconductor structures

INTEL CORP0 citations51
US7704895B2Apr 27, 2010

Deposition method for high-k dielectric materials

INTEL CORP1 citations51
US7687225B2Mar 30, 2010

Optical coatings

INTEL CORP1 citations47

LAVOIE ADRIEN R

2 patents

DOMINGUEZ JUAN E

1 patent

ADVANCED TECH MATERIALS

1 patent