Inventor

BERNARD DAVID LAURIER

US7 patents

⚠️ This page may combine multiple inventors who share the name “BERNARD DAVID LAURIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BERNARD DAVID LAURIER

4 patents

US8324076B2Dec 4, 2012

Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods

BERNARD DAVID LAURIER1 citations48

LEXMARK INT INC

2 patents

US7938513B2May 10, 2011

Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips

LEXMARK INT INC7 citations82

US7815289B2Oct 19, 2010

Micro-fluid ejection heads and methods for bonding substrates to supports

LEXMARK INT INC0 citations50

ANDERSON FRANK EDWARD

1 patent

US8087756B2Jan 3, 2012

Heater chips with silicon die bonded on silicon substrate

ANDERSON FRANK EDWARD5 citations60

BERNARD DAVID LAURIER

BERNARD DAVID LAURIER

Micro-fluid ejection heads and methods for bonding substrates to supports

Modular micro-fluid ejection head assembly

Method for making a substantially planar micro-fluid ejection head

Methods for planarizing unevenness on surface of wafer photoresist layer and wafers produced by the methods

LEXMARK INT INC

Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips

Micro-fluid ejection heads and methods for bonding substrates to supports

ANDERSON FRANK EDWARD

Heater chips with silicon die bonded on silicon substrate