Inventor

DELPRAT DANIEL

FR25 patents

⚠️ This page may combine multiple inventors who share the name “DELPRAT DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DELPRAT DANIEL

SOITEC SILICON ON INSULATOR

Methods for manufacturing compound-material wafers and for recycling used donor substrates

Method for manufacturing a semiconductor on insulator structure having low electrical losses

Bonding interface quality by cold cleaning and hot bonding

Method for manufacturing a semiconductor-on-insulator structure having low electrical losses

Heterostructure and method of fabrication

Heterostructure and method of fabrication

Heterostructure and method of fabrication

Heterostructure and method of fabrication

Method for molecular bonding of silicon and glass substrates

Method of bonding two substrates

Method of configuring a process to obtain a thin layer with a low density of holes

Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate

Method for transferring a thin layer onto a support substrate provided with a charge-trapping layer

Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

Method for manufacturing a semiconductor on insulator type structure by layer transfer

Methods for preparing a bonding surface of a semiconductor wafer

CORNING INC

Tunable gain-clamped semiconductor optical amplifier

Semiconductor on glass substrate with stiffening layer and process of making the same

Vertically-tolerant alignment using slanted wall pedestal

Semiconductor on glass substrate with stiffening layer

KERDILES SEBASTIEN

Method for molecular bonding of silicon and glass substrates

LALLEMENT FABRICE

Method for transferring a layer of a semiconductor and substrate comprising a confinement structure

REYNAUD PATRICK

Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure

DELPRAT DANIEL

Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate

MOHAMED NADIA BEN

Process of making semiconductor on glass substrates with a stiffening layer