P

Inventor

LIN YUEH-CHIOU

TW12 patents
⚠️ This page may combine multiple inventors who share the name “LIN YUEH-CHIOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

5 patents
US9653508B2May 16, 2017

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11996368B2May 28, 2024

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11728279B2Aug 15, 2023

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11227836B2Jan 18, 2022

Pad structure for enhanced bondability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10535696B2Jan 14, 2020

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG

3 patents
US7521741B2Apr 21, 2009

Shielding structures for preventing leakages in high voltage MOS devices

TAIWAN SEMICONDUCTOR MFG9 citations82
US9184207B2Nov 10, 2015

Pad structures formed in double openings in dielectric layers

TAIWAN SEMICONDUCTOR MFG2 citations63
US9362329B2Jun 7, 2016

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

TAIWAN SEMICONDUCTOR MFG0 citations52

LIN JENG-SHYAN

2 patents
US9013022B2Apr 21, 2015

Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips

LIN JENG-SHYAN7 citations83
US8987855B2Mar 24, 2015

Pad structures formed in double openings in dielectric layers

LIN JENG-SHYAN1 citations51

TSAI SHUANG-JI

2 patents
US8435824B2May 7, 2013

Backside illumination sensor having a bonding pad structure and method of making the same

TSAI SHUANG-JI18 citations83
US8664736B2Mar 4, 2014

Bonding pad structure for a backside illuminated image sensor device and method of manufacturing the same

TSAI SHUANG-JI3 citations62