Inventor
SONG YOUNG-JAE
KR36 patents
⚠️ This page may combine multiple inventors who share the name “SONG YOUNG-JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS5897339AApr 27, 1999
Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD122 citations98
US9568238B2Feb 14, 2017
Refrigerator
SAMSUNG ELECTRONICS CO LTD60 citations97
US5710064AJan 20, 1998
Method for manufacturing a semiconductor package
SAMSUNG ELECTRONICS CO LTD276 citations97
US6552423B2Apr 22, 2003
Higher-density memory card
SAMSUNG ELECTRONICS CO LTD219 citations96
US6087722AJul 11, 2000
Multi-chip package
SAMSUNG ELECTRONICS CO LTD260 citations96
US5776799AJul 7, 1998
Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same
SAMSUNG ELECTRONICS CO LTD84 citations96
US9810475B2Nov 7, 2017
Refrigerator and method of fabricating inner door thereof
SAMSUNG ELECTRONICS CO LTD33 citations94
US9631857B2Apr 25, 2017
Refrigerator
SAMSUNG ELECTRONICS CO LTD22 citations93
US10337785B2Jul 2, 2019
Refrigerator
SAMSUNG ELECTRONICS CO LTD9 citations92
US5834832ANov 10, 1998
Packing structure of semiconductor packages
SAMSUNG ELECTRONICS CO LTD52 citations92
US9279609B2Mar 8, 2016
Refrigerator and method of manufacturing inner door thereof
SAMSUNG ELECTRONICS CO LTD33 citations91
US5923957AJul 13, 1999
Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive
SAMSUNG ELECTRONICS CO LTD26 citations89
US11808513B2Nov 7, 2023
Refrigerator
SAMSUNG ELECTRONICS CO LTD3 citations83
US11226151B2Jan 18, 2022
Refrigerator
SAMSUNG ELECTRONICS CO LTD4 citations83
US10690394B2Jun 23, 2020
Refrigerator
SAMSUNG ELECTRONICS CO LTD7 citations83
US9982936B2May 29, 2018
Refrigerator
SAMSUNG ELECTRONICS CO LTD8 citations83
US9368177B2Jun 14, 2016
Magnetic resistance structure, method of manufacturing the magnetic resistance structure, and electronic device including the magnetic resistance structure
SAMSUNG ELECTRONICS CO LTD6 citations81
US9091476B2Jul 28, 2015
Refrigerator and method of manufacturing inner door thereof
SAMSUNG ELECTRONICS CO LTD5 citations72
US5849607ADec 15, 1998
Process for attaching a lead frame to a semiconductor chip
SAMSUNG ELECTRONICS CO LTD14 citations71
US12169093B2Dec 17, 2024
Refrigerator
SAMSUNG ELECTRONICS CO LTD0 citations62
US9287116B2Mar 15, 2016
Method of forming multilayer graphene structure
SAMSUNG ELECTRONICS CO LTD2 citations58
US10024592B2Jul 17, 2018
Refrigerator and method of fabricating inner door thereof
SAMSUNG ELECTRONICS CO LTD1 citations52
US9515143B2Dec 6, 2016
Heterogeneous layered structure, method of preparing the heterogeneous layered structure, and electronic device including the heterogeneous layered structure
SAMSUNG ELECTRONICS CO LTD0 citations52
US9709306B2Jul 18, 2017
Suction pipe and capillary tube arrangement for a refrigerator
SAMSUNG ELECTRONICS CO LTD1 citations46
US10096756B2Oct 9, 2018
Side view light emitting diode package
SAMSUNG ELECTRONICS CO LTD0 citations40
SAMSUNG ELECTRO MECH
8 patentsUS7242035B2Jul 10, 2007
Side view LED package having lead frame structure designed to improve resin flow
SAMSUNG ELECTRO MECH25 citations93
USD568261SMay 6, 2008
Light-emitting diode
SAMSUNG ELECTRO MECH22 citations91
USD528998SSep 26, 2006
Light-emitting diode
SAMSUNG ELECTRO MECH30 citations91
US7663199B2Feb 16, 2010
High power light emitting diode package and fabrication method thereof
SAMSUNG ELECTRO MECH9 citations84
USD522468SJun 6, 2006
Light-emitting diode
SAMSUNG ELECTRO MECH14 citations84
USD533517SDec 12, 2006
Light-emitting diode
SAMSUNG ELECTRO MECH12 citations83
USD538760SMar 20, 2007
Light-emitting diode
SAMSUNG ELECTRO MECH8 citations70
USD521951SMay 30, 2006
Light-emitting diode
SAMSUNG ELECTRO MECH5 citations63