Inventor
ADDERLY SHAWN A
US15 patents
⚠️ This page may combine multiple inventors who share the name “ADDERLY SHAWN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS10224225B2Mar 5, 2019
Centering substrates on a chuck
IBM2 citations72
US9997385B2Jun 12, 2018
Centering substrates on a chuck
IBM2 citations72
US9685362B2Jun 20, 2017
Apparatus and method for centering substrates on a chuck
IBM3 citations72
US9583401B2Feb 28, 2017
Nano deposition and ablation for the repair and fabrication of integrated circuits
IBM2 citations72
US9275868B2Mar 1, 2016
Uniform roughness on backside of a wafer
IBM2 citations62
US9087839B2Jul 21, 2015
Semiconductor structures with metal lines
IBM2 citations61
US9196519B2Nov 24, 2015
Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer
IBM0 citations52
US10607899B2Mar 31, 2020
Nano deposition and ablation for the repair and fabrication of integrated circuits
IBM0 citations51
US9006703B2Apr 14, 2015
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
IBM0 citations50
US9201806B2Dec 1, 2015
Anticipatorily loading a page of memory
IBM0 citations47
US9576863B2Feb 21, 2017
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
IBM0 citations46
US9330988B1May 3, 2016
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
IBM1 citations46
GLOBALFOUNDRIES INC
3 patentsUS9508578B2Nov 29, 2016
Method and apparatus for detecting foreign material on a chuck
GLOBALFOUNDRIES INC3 citations72
US10078183B2Sep 18, 2018
Waveguide structures used in phonotics chip packaging
GLOBALFOUNDRIES INC5 citations70
US9543219B2Jan 10, 2017
Void monitoring device for measurement of wafer temperature variations
GLOBALFOUNDRIES INC4 citations68