Inventor
MOON MATTHEW D
US19 patents
⚠️ This page may combine multiple inventors who share the name “MOON MATTHEW D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
15 patentsUS6340601B1Jan 22, 2002
Method for reworking copper metallurgy in semiconductor devices
IBM26 citations87
US7301752B2Nov 27, 2007
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
IBM10 citations82
US7382055B2Jun 3, 2008
Integrated thin-film resistor with direct contact
IBM7 citations73
US7303972B2Dec 4, 2007
Integrated thin-film resistor with direct contact
IBM6 citations73
US10224225B2Mar 5, 2019
Centering substrates on a chuck
IBM2 citations72
US9997385B2Jun 12, 2018
Centering substrates on a chuck
IBM2 citations72
US9685362B2Jun 20, 2017
Apparatus and method for centering substrates on a chuck
IBM3 citations72
US7682945B2Mar 23, 2010
Phase change element extension embedded in an electrode
IBM2 citations63
US9275868B2Mar 1, 2016
Uniform roughness on backside of a wafer
IBM2 citations62
US9087839B2Jul 21, 2015
Semiconductor structures with metal lines
IBM2 citations61
US9059258B2Jun 16, 2015
Controlled metal extrusion opening in semiconductor structure and method of forming
IBM0 citations51
US9006703B2Apr 14, 2015
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof
IBM0 citations50
US7511940B2Mar 31, 2009
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask
IBM0 citations50
US9576863B2Feb 21, 2017
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
IBM0 citations46
US9330988B1May 3, 2016
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness
IBM1 citations46