Inventor

HEDRICK JEFFREY C

US37 patents

⚠️ This page may combine multiple inventors who share the name “HEDRICK JEFFREY C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEDRICK JEFFREY C

IBM

Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same

Coaxial vias in an electronic substrate

System for applying microware energy in processing sheet like materials

Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same

Prepreg and cured laminate fabricated from a toughened polycyanurate

Multilayer article having a planarized outer layer comprising a toughened polycyanurate

Toughened polycyanurate resins containing particulates

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Patterning layers comprised of spin-on ceramic films

Fluid jet impregnation

Expandable fluid treatment device for tublar surface treatments

Fluorinated carbon polymer composites

Fluorinated carbon polymer composites

Hybrid dielectric structure for improving the stiffness of back end of the line structures

Multilayered cap barrier in microelectronic interconnect structures

Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures

Modified dicyanate ester resins having enhanced fracture toughness

Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same

Method of fabricating a multilayered dielectric diffusion barrier layer

Method of forming a ceramic diffusion barrier layer

Interconnect structures incorporating low-k dielectric barrier films

Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens

Patterning layers comprised of spin-on ceramic films

Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens

Film planarization for low-k polymers used in semiconductor structures

Multilayer article comprising a toughened polycyanurate

Structures fabricated from toughened polycyanurate

Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns

Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making

Multilayered cap barrier in microelectronic interconnect structures

Nonlithographic method to produce masks by selective reaction, articles produced, and composition for same

Composition and method to achieve reduced thermal expansion in polyarylene networks

Method for reworking low-k polymers used in semiconductor structures

HEDRICK JEFFREY C

Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures

COLBURN MATTHEW E

Selectively coated self-aligned mask

AFZALI-ARDAKANI ALI

Non-lithographic method of patterning contacts for a photovoltaic device