Inventor
PAPATHOMAS KONSTANTINOS
US23 patents
Patents
23 patentsUS5796587AAug 18, 1998
Printed circut board with embedded decoupling capacitance and method for producing same
IBM99 citations98
US5981312ANov 9, 1999
Method for injection molded flip chip encapsulation
IBM72 citations96
US5599611AFeb 4, 1997
Prepreg and cured laminate fabricated from a toughened polycyanurate
IBM30 citations96
US5527838AJun 18, 1996
Toughened polycyanurate resins containing particulates
IBM30 citations96
US5527592AJun 18, 1996
Multilayer article having a planarized outer layer comprising a toughened polycyanurate
IBM28 citations96
US6739027B1May 25, 2004
Method for producing printed circuit board with embedded decoupling capacitance
IBM23 citations92
US6407461B1Jun 18, 2002
Injection molded integrated circuit chip assembly
IBM37 citations92
US6256850B1Jul 10, 2001
Method for producing a circuit board with embedded decoupling capacitance
IBM28 citations92
US5824157AOct 20, 1998
Fluid jet impregnation
IBM21 citations92
US5827907AOct 27, 1998
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
IBM19 citations91
US5548034AAug 20, 1996
Modified dicyanate ester resins having enhanced fracture toughness
IBM10 citations82
US5529836AJun 25, 1996
Multilayer article comprising a toughened polycyanurate
IBM7 citations74
US5527593AJun 18, 1996
Structures fabricated from toughened polycyanurate
IBM9 citations74
US5523148AJun 4, 1996
Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns
IBM9 citations74
US6570261B2May 27, 2003
Method and apparatus for injection molded flip chip encapsulation
IBM11 citations73
US5919596AJul 6, 1999
Toughened photosensitive polycyanurate resist, and structure made therefrom and process of making
IBM12 citations73
US5834537ANov 10, 1998
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
IBM8 citations72
US5206074AApr 27, 1993
Adhesives on polymide films and methods of preparing them
IBM12 citations72
US5281723AJan 25, 1994
Propylene carbonate recovery process
IBM8 citations71
US7467742B1Dec 23, 2008
Electrically conducting adhesives for via fill applications
IBM2 citations63
US6251469B1Jun 26, 2001
Method of rendering a substrate selectively non-wettable chip carrier with enhanced wire bondability
IBM2 citations62
US6225373B1May 1, 2001
Homo-, co- or multicomponent thermoplastic polymer dispersed in a thermoset resin
IBM2 citations61
US6534186B2Mar 18, 2003
Chip carriers with enhanced wire bondability
IBM0 citations52