Inventor
PATEL NIRANJAN M
US20 patents
⚠️ This page may combine multiple inventors who share the name “PATEL NIRANJAN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS5370825ADec 6, 1994
Water-soluble electrically conducting polymers, their synthesis and use
IBM101 citations97
US6114082ASep 5, 2000
Frequency doubling hybrid photoresist having negative and positive tone components and method of preparing the same
IBM81 citations96
US5599611AFeb 4, 1997
Prepreg and cured laminate fabricated from a toughened polycyanurate
IBM30 citations96
US5527838AJun 18, 1996
Toughened polycyanurate resins containing particulates
IBM30 citations96
US5527592AJun 18, 1996
Multilayer article having a planarized outer layer comprising a toughened polycyanurate
IBM28 citations96
US6372412B1Apr 16, 2002
Method of producing an integrated circuit chip using frequency doubling hybrid photoresist and apparatus formed thereby
IBM16 citations93
US6313492B1Nov 6, 2001
Integrated circuit chip produced by using frequency doubling hybrid photoresist
IBM22 citations93
US6440635B1Aug 27, 2002
Low “K” factor hybrid photoresist
IBM16 citations92
US6284439B1Sep 4, 2001
Method of producing an integrated circuit chip using low “k” factor hybrid photoresist and apparatus formed thereby
IBM24 citations92
US6190829B1Feb 20, 2001
Low “K” factor hybrid photoresist
IBM24 citations91
US5548034AAug 20, 1996
Modified dicyanate ester resins having enhanced fracture toughness
IBM10 citations82
US5529836AJun 25, 1996
Multilayer article comprising a toughened polycyanurate
IBM7 citations74
US5527593AJun 18, 1996
Structures fabricated from toughened polycyanurate
IBM9 citations74
US5523148AJun 4, 1996
Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns
IBM9 citations74
US5785800AJul 28, 1998
Apparatus for forming cavity structures using thermally decomposable surface layer
IBM15 citations73
US5676788AOct 14, 1997
Method for forming cavity structures using thermally decomposable surface layer
IBM14 citations73
US5552232ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM4 citations72
US5552107ASep 3, 1996
Aluminum nitride body having graded metallurgy
IBM9 citations72