Inventor
SHAW JANE M
US56 patents
Patents
50 patentsUS6929900B2Aug 16, 2005
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM127 citations98
US5582858ADec 10, 1996
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM113 citations98
US5536921AJul 16, 1996
System for applying microware energy in processing sheet like materials
IBM140 citations98
US5470661ANov 28, 1995
Diamond-like carbon films from a hydrocarbon helium plasma
IBM362 citations98
US4975079ADec 4, 1990
Connector assembly for chip testing
IBM240 citations98
US6686539B2Feb 3, 2004
Tamper-responding encapsulated enclosure having flexible protective mesh structure
IBM109 citations97
US5198153AMar 30, 1993
Electrically conductive polymeric
IBM232 citations97
US6030550AFeb 29, 2000
Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof
IBM41 citations96
US5599611AFeb 4, 1997
Prepreg and cured laminate fabricated from a toughened polycyanurate
IBM30 citations96
US5527592AJun 18, 1996
Multilayer article having a planarized outer layer comprising a toughened polycyanurate
IBM28 citations96
US5527838AJun 18, 1996
Toughened polycyanurate resins containing particulates
IBM30 citations96
US5495397AFeb 27, 1996
Three dimensional package and architecture for high performance computer
IBM46 citations96
US5326643AJul 5, 1994
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM41 citations96
US5191182AMar 2, 1993
Tuneable apparatus for microwave processing
IBM81 citations96
US5041358AAug 20, 1991
Negative photoresist and use thereof
IBM58 citations96
US5591285AJan 7, 1997
Fluorinated carbon polymer composites
IBM38 citations95
US5569501AOct 29, 1996
Diamond-like carbon films from a hydrocarbon helium plasma
IBM82 citations95
US5397863AMar 14, 1995
Fluorinated carbon polymer composites
IBM35 citations95
US5534094AJul 9, 1996
Method for fabricating multi-layer thin film structure having a separation layer
IBM54 citations94
US5258236ANov 2, 1993
Multi-layer thin film structure and parallel processing method for fabricating same
IBM92 citations94
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Method of modifying the development profile of photoresists
IBM99 citations94
US6383415B1May 7, 2002
Methods of fabrication of cross-linked electrically conductive polymers and precursors thereof
IBM17 citations93
US5382637AJan 17, 1995
Solid state chain extension polymerization between Lewis acid oligomers and deblocked Lewis bases
IBM24 citations93
US5324813AJun 28, 1994
Low dielectric constant fluorinated polymers and methods of fabrication thereof
IBM27 citations93
US5317081AMay 31, 1994
Microwave processing
IBM32 citations93
US5793836AAug 11, 1998
X-ray mask pellicle
IBM51 citations92
US5599582AFeb 4, 1997
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM25 citations92
US5571852ANov 5, 1996
Fluorinated carbon polymer composites
IBM20 citations92
US5556899ASep 17, 1996
Fluorinated carbon polymer composites
IBM28 citations92
US5296189AMar 22, 1994
Method for producing metal powder with a uniform distribution of dispersants, method of uses thereof and structures fabricated therewith
IBM39 citations92
US5241040AAug 31, 1993
Microwave processing
IBM32 citations92
US5059512AOct 22, 1991
Ultraviolet light sensitive photoinitiator compositions, use thereof and radiation sensitive compositions
IBM27 citations92
US5721299AFeb 24, 1998
Electrically conductive and abrasion/scratch resistant polymeric materials, method of fabrication thereof and uses thereof
IBM46 citations91
US5202061AApr 13, 1993
Electrically conductive polymeric materials and uses thereof
IBM50 citations91
US5200112AApr 6, 1993
Electrically conductive polymeric materials and uses thereof
IBM45 citations91
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Plasma-resistant polymeric material, preparation thereof, and use thereof
IBM33 citations91
US5548034AAug 20, 1996
Modified dicyanate ester resins having enhanced fracture toughness
IBM10 citations82
US5141817AAug 25, 1992
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM18 citations81
US6193909B1Feb 27, 2001
Cross-linked electrically conductive polymers, precursors thereof
IBM11 citations74
US5569739AOct 29, 1996
Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
IBM4 citations74
US5529836AJun 25, 1996
Multilayer article comprising a toughened polycyanurate
IBM7 citations74
US5527593AJun 18, 1996
Structures fabricated from toughened polycyanurate
IBM9 citations74
US5523148AJun 4, 1996
Multilayer article comprising a toughened polycyanurate with embedded electrically conductive patterns
IBM9 citations74
US5115095AMay 19, 1992
Epoxy functional organosilicon polymer
IBM7 citations74
US5110711AMay 5, 1992
Method for forming a pattern
IBM9 citations74
US5098816AMar 24, 1992
Method for forming a pattern of a photoresist
IBM10 citations74
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Organic solder barrier
IBM10 citations74
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Organosilicon compound and use thereof in photolithography
IBM11 citations74
US5565529AOct 15, 1996
Dielectric structures having embedded gap filling RIE etch stop polymeric materials of high thermal stability
IBM11 citations73
US5340914AAug 23, 1994
Microwave processing
IBM5 citations73
Showing the top 50 of 56 patents by PatentIndex Score.