Inventor

VAN GRUNSVEN ERIC CORNELIS EGBERTUS

NL7 patents

⚠️ This page may combine multiple inventors who share the name “VAN GRUNSVEN ERIC CORNELIS EGBERTUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHILIPS LIGHTING HOLDING BV

2 patents

US10107489B2Oct 23, 2018

Particulate water-activatable luminescent materials

PHILIPS LIGHTING HOLDING BV1 citations49

US9961778B2May 1, 2018

Liquid immersion transfer of electronics

PHILIPS LIGHTING HOLDING BV0 citations49

KONINKLIJKE PHILIPS NV

2 patents

US10084110B2Sep 25, 2018

Low warpage wafer bonding through use of slotted substrates

KONINKLIJKE PHILIPS NV0 citations48

US9583676B2Feb 28, 2017

Low warpage wafer bonding through use of slotted substrates

KONINKLIJKE PHILIPS NV1 citations48

NXP BV

1 patent

US7704881B2Apr 27, 2010

Producing a covered through substrate via using a temporary cap layer

NXP BV11 citations82

ROOZEBOOM FREDDY

1 patent

US8395267B2Mar 12, 2013

Through-substrate via and redistribution layer with metal paste

ROOZEBOOM FREDDY7 citations76

SIGNIFY HOLDING BV

1 patent

US12092271B2Sep 17, 2024

Optical and thermal improvement of a two-sided multi-channel filament

SIGNIFY HOLDING BV0 citations48