Inventor

HSIAO WEI-CHUNG

TW34 patents

⚠️ This page may combine multiple inventors who share the name “HSIAO WEI-CHUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIAO WEI-CHUNG

SILICONWARE PRECISION INDUSTRIES CO LTD

Package structure and fabrication method thereof

Method for fabricating package structure

Package structure and fabrication method thereof

Method of fabricating semiconductor package structure

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

Semiconductor package structure and method of fabricating the same

Method of fabricating package structure with an embedded electronic component

Fabrication method of coreless packaging substrate

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

Package structure with an embedded electronic component and method of fabricating the package structure

Package structure having a laminated release layer and method for fabricating the same

Coreless packaging substrate and fabrication method thereof

Fabrication method of semiconductor package

Method of fabricating a packaging substrate including a carrier having two carrying portions

GETAC TECHNOLOGY CORP

Bendable heat plate

Decryption method for use in displaying data

Vehicle camera

Heat dissipation module and assembly method thereof

Event detecting and recording system, management method and activating method for information capturing device

Wave absorbing heat dissipation structure

Heat dissipation and shockproof structure

HSIAO WEI-CHUNG

Image presentation angle adjustment method and camera device using the same

Apparatus and method of protecting electronic apparatus using a temperature-power table for an electronic component under different system and environmental temperatures

Heat pipe structure and flattened heat pipe structure

MITAC TECHNOLOGY CORP

Heat pipe with guided internal grooves and heat dissipation module incorporating the same

Printed circuit board structure and manufacturing method thereof

Chip heat dissipation structure and manufacturing method

LAI JENG-MING

Flow resistance device

Heat dissipating assembly and elastic fastening member thereof

COMPAL ELECTRONICS INC

Cooler module and its fastening structure

WISTRON CORP

Detection system and transient pressure response detection method for detecting residual air bubbles in liquid-cooling system and flow rate control device for using the same

WANG CHUN-CHI

Method, circuit, and electronic device for controlling rotation speed of fan

HSIAO WEI CHUNG

Semiconductor package and fabrication method thereof

YANG WEN-HSIUNG

Airflow adjustment device and blade server