Inventor
LO CHUN-YEN
TW13 patents
⚠️ This page may combine multiple inventors who share the name “LO CHUN-YEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS10535554B2Jan 14, 2020
Semiconductor die having edge with multiple gradients and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10741513B2Aug 11, 2020
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11908843B2Feb 20, 2024
Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US11211318B2Dec 28, 2021
Bump layout for coplanarity improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12087618B2Sep 10, 2024
Method for forming semiconductor die having edge with multiple gradients
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004728B2May 11, 2021
Semiconductor die having edge with multiple gradients and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527504B2Dec 13, 2022
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12406970B2Sep 2, 2025
Semiconductor package and method of bonding workpieces
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12381191B2Aug 5, 2025
Semiconductor package, method of bonding workpieces and method of manufacturing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US10163836B2Dec 25, 2018
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9875979B2Jan 23, 2018
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50