Inventor
CHEN WEN-MING
TW27 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WEN-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
15 patentsUS10014218B1Jul 3, 2018
Method for forming semiconductor device structure with bumps
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations83
US11367658B2Jun 21, 2022
Semiconductor die singulation and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10720360B2Jul 21, 2020
Semiconductor die singulation and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510605B2Dec 17, 2019
Semiconductor die singulation and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10535554B2Jan 14, 2020
Semiconductor die having edge with multiple gradients and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10741513B2Aug 11, 2020
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US11211318B2Dec 28, 2021
Bump layout for coplanarity improvement
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations68
US12087618B2Sep 10, 2024
Method for forming semiconductor die having edge with multiple gradients
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004728B2May 11, 2021
Semiconductor die having edge with multiple gradients and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527504B2Dec 13, 2022
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10163836B2Dec 25, 2018
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9875979B2Jan 23, 2018
Conductive external connector structure and method of forming
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US10861761B2Dec 8, 2020
Semiconductor packaged wafer and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations38
US10312118B2Jun 4, 2019
Bonding apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations36
US9748130B2Aug 29, 2017
Wafer taping scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations35
TAIWAN SEMICONDUCTOR MFG
3 patentsUS6723201B2Apr 20, 2004
Microchip fabrication chamber wafer detection
TAIWAN SEMICONDUCTOR MFG9 citations73
US6822575B2Nov 23, 2004
Backfill prevention system for gas flow conduit
TAIWAN SEMICONDUCTOR MFG3 citations54
US7396432B2Jul 8, 2008
Composite shadow ring assembled with dowel pins and method of using
TAIWAN SEMICONDUCTOR MFG0 citations42
HONGFUJIN PREC IND SHENZHEN
3 patentsUS7804195B2Sep 28, 2010
Power supply system and protection method
HONGFUJIN PREC IND SHENZHEN6 citations60
US7663433B2Feb 16, 2010
Audio amplifier
HONGFUJIN PREC IND SHENZHEN1 citations50
US7916440B2Mar 29, 2011
Power interface circuit and electronic device using the same
HONGFUJIN PREC IND SHENZHEN0 citations39