Inventor
ZHANG YU AMOS
US8 patents
Patents
8 patentsUS10784204B2Sep 22, 2020
Rlink—die to die channel interconnect configurations to improve signaling
INTEL CORP3 citations72
US11031341B2Jun 8, 2021
Side mounted interconnect bridges
INTEL CORP2 citations66
US10886171B2Jan 5, 2021
Rlink-on-die interconnect features to enable signaling
INTEL CORP0 citations60
US10396036B2Aug 27, 2019
Rlink-ground shielding attachment structures and shadow voiding for data signal contacts of package devices; vertical ground shielding structures and shield fencing of vertical data signal interconnects of package devices; and ground shielding for electro optical module connector data signal contacts and contact pins of package devices
INTEL CORP0 citations51
US10580734B2Mar 3, 2020
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
INTEL CORP0 citations47
US10453795B2Oct 22, 2019
Microprocessor package with first level die bump ground webbing structure
INTEL CORP0 citations40
US9935063B2Apr 3, 2018
Rlink-on-die inductor structures to improve signaling
INTEL CORP0 citations39
US10607951B2Mar 31, 2020
Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices
INTEL CORP0 citations36