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Inventor

REID JONATHAN

US27 patents
⚠️ This page may combine multiple inventors who share the name “REID JONATHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NOVELLUS SYSTEMS INC

13 patents
US6193859B1Feb 27, 2001

Electric potential shaping apparatus for holding a semiconductor wafer during electroplating

NOVELLUS SYSTEMS INC159 citations98
US6159354ADec 12, 2000

Electric potential shaping method for electroplating

NOVELLUS SYSTEMS INC182 citations98
US6551483B1Apr 22, 2003

Method for potential controlled electroplating of fine patterns on semiconductor wafers

NOVELLUS SYSTEMS INC110 citations97
US7964506B1Jun 21, 2011

Two step copper electroplating process with anneal for uniform across wafer deposition and void free filling on ruthenium coated wafers

NOVELLUS SYSTEMS INC60 citations95
US6946065B1Sep 20, 2005

Process for electroplating metal into microscopic recessed features

NOVELLUS SYSTEMS INC60 citations95
US6562204B1May 13, 2003

Apparatus for potential controlled electroplating of fine patterns on semiconductor wafers

NOVELLUS SYSTEMS INC47 citations95
US9309604B2Apr 12, 2016

Method and apparatus for electroplating

NOVELLUS SYSTEMS INC18 citations92
US7854828B2Dec 21, 2010

Method and apparatus for electroplating including remotely positioned second cathode

NOVELLUS SYSTEMS INC50 citations92
US8048280B2Nov 1, 2011

Process for electroplating metals into microscopic recessed features

NOVELLUS SYSTEMS INC24 citations91
US7799684B1Sep 21, 2010

Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers

NOVELLUS SYSTEMS INC22 citations90
US9385035B2Jul 5, 2016

Current ramping and current pulsing entry of substrates for electroplating

NOVELLUS SYSTEMS INC10 citations83
US7211175B1May 1, 2007

Method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers

NOVELLUS SYSTEMS INC7 citations73
US8377824B1Feb 19, 2013

Methods and apparatus for depositing copper on tungsten

NOVELLUS SYSTEMS INC0 citations49

FACEBOOK TECH LLC

3 patents

MAYER STEVEN

2 patents

REID JONATHAN

2 patents

BUCKALEW BRYAN

2 patents

META PLATFORMS TECH LLC

2 patents

IBM

1 patent

DANEK MICHAL

1 patent

CERIO JR FRANK M

1 patent