Inventor
TAKAOKA YUJI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “TAKAOKA YUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SONY CORP
15 patentsUS7402901B2Jul 22, 2008
Semiconductor device and method of manufacturing semiconductor device
SONY CORP213 citations97
US7851880B2Dec 14, 2010
Solid-state imaging device
SONY CORP25 citations92
US7064005B2Jun 20, 2006
Semiconductor apparatus and method of manufacturing same
SONY CORP13 citations84
US6936525B2Aug 30, 2005
Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
SONY CORP15 citations84
US9379155B2Jun 28, 2016
Semiconductor device and method of manufacturing the same
SONY CORP5 citations83
US10418340B2Sep 17, 2019
Semiconductor chip mounted on a packaging substrate
SONY CORP2 citations73
US9041179B2May 26, 2015
Semiconductor device and method of manufacturing the same
SONY CORP3 citations73
US11315970B2Apr 26, 2022
Semiconductor device and method of manufacturing the same
SONY CORP2 citations72
US10050074B2Aug 14, 2018
Semiconductor device and method of manufacturing the same
SONY CORP3 citations72
US5827436AOct 27, 1998
Method for etching aluminum metal films
SONY CORP9 citations68
US7135378B2Nov 14, 2006
Process for fabricating a semiconductor device having a plurality of encrusted semiconductor chips
SONY CORP6 citations61
US10014248B2Jul 3, 2018
Semiconductor device with less positional deviation between aperture and solder
SONY CORP1 citations52
US11171170B2Nov 9, 2021
Image sensor package with flexible printed circuits
SONY CORP0 citations47
US10867950B2Dec 15, 2020
Semiconductor device with a gap control electrode and method of manufacturing the semiconductor device
SONY CORP0 citations41
US10720402B2Jul 21, 2020
Semiconductor device and method of manufacturing the same
SONY CORP0 citations41
SONY SEMICONDUCTOR SOLUTIONS CORP
4 patentsUS11800249B2Oct 24, 2023
Imaging device for connection with a circuit element
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations60
US11245863B2Feb 8, 2022
Imaging device for connection with a circuit element
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations60
US11356584B2Jun 7, 2022
Camera module, production method, and electronic device
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations49
US10720459B2Jul 21, 2020
Imaging element package and camera module having a slit formed in an adhesive connecting a flexible substrate and another member to address differences in linear expansion coefficients
SONY SEMICONDUCTOR SOLUTIONS CORP0 citations49