Inventor
MYUNG JUN WOO
KR14 patents
⚠️ This page may combine multiple inventors who share the name “MYUNG JUN WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
11 patentsUS10847476B2Nov 24, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US10475776B2Nov 12, 2019
Fan-out semiconductor package module
SAMSUNG ELECTRONICS CO LTD2 citations71
US10541187B2Jan 21, 2020
Semiconductor package including organic interposer
SAMSUNG ELECTRONICS CO LTD2 citations70
US10504836B2Dec 10, 2019
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations70
US11195790B2Dec 7, 2021
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations59
US12568839B2Mar 3, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12463104B2Nov 4, 2025
Semiconductor package and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12381172B2Aug 5, 2025
Semiconductor package and fabricating method thereof
SAMSUNG ELECTRONICS CO LTD0 citations50
US10854528B2Dec 1, 2020
Semiconductor package including organic interposer
SAMSUNG ELECTRONICS CO LTD0 citations49
US11043449B2Jun 22, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations43
US10692791B2Jun 23, 2020
Electronic component package with electromagnetic wave shielding
SAMSUNG ELECTRONICS CO LTD0 citations39
SAMSUNG ELECTRO MECH
3 patentsUS9521756B2Dec 13, 2016
Power module package and method of fabricating the same
SAMSUNG ELECTRO MECH0 citations51
US9305829B2Apr 5, 2016
Semiconductor package with an indented portion and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations50
US9281257B2Mar 8, 2016
Semiconductor package including a connecting member
SAMSUNG ELECTRO MECH0 citations50