P

Inventor

SUKEKAWA MITSUNARI

JP45 patents
⚠️ This page may combine multiple inventors who share the name “SUKEKAWA MITSUNARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

34 patents
US10103053B1Oct 16, 2018

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC19 citations94
US9666573B1May 30, 2017

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC49 citations94
US9245893B1Jan 26, 2016

Semiconductor constructions having grooves dividing active regions

MICRON TECHNOLOGY INC26 citations94
US10410912B2Sep 10, 2019

Integrated circuitry

MICRON TECHNOLOGY INC6 citations84
US11706909B2Jul 18, 2023

Integrated assemblies comprising memory cells and shielding material between the memory cells

MICRON TECHNOLOGY INC3 citations73
US11171140B2Nov 9, 2021

Semiconductor memory device and method of forming the same

MICRON TECHNOLOGY INC3 citations73
US10910379B2Feb 2, 2021

Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC2 citations73
US10868078B2Dec 15, 2020

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC1 citations73
US10867837B2Dec 15, 2020

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC1 citations73
US10861787B1Dec 8, 2020

Memory device with bitline noise suppressing scheme

MICRON TECHNOLOGY INC6 citations73
US10600772B2Mar 24, 2020

Semiconductor memory device having plural chips connected by hybrid bonding method

MICRON TECHNOLOGY INC3 citations73
US10535710B2Jan 14, 2020

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC3 citations73
US10504961B2Dec 10, 2019

Methods of forming integrated circuitry

MICRON TECHNOLOGY INC3 citations73
US10340261B1Jul 2, 2019

Semiconductor memory device having plural chips connected by hybrid bonding method

MICRON TECHNOLOGY INC2 citations73
US11217588B2Jan 4, 2022

Integrated assemblies comprising voids between active regions and conductive shield plates, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC2 citations72
US11139302B2Oct 5, 2021

Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assemblies

MICRON TECHNOLOGY INC5 citations72
US12520475B2Jan 6, 2026

Semiconductor memory device and method of forming the same

MICRON TECHNOLOGY INC1 citations64
US11744061B2Aug 29, 2023

Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cells

MICRON TECHNOLOGY INC0 citations63
US11488963B2Nov 1, 2022

Method of forming a semiconductor device

MICRON TECHNOLOGY INC0 citations63
US11177266B2Nov 16, 2021

Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cells

MICRON TECHNOLOGY INC0 citations63
US12495535B2Dec 9, 2025

Compact microelectronic 6T SRAM memory devices, and related systems and methods

MICRON TECHNOLOGY INC0 citations62
US11917814B2Feb 27, 2024

Semiconductor device

MICRON TECHNOLOGY INC0 citations62
US11917808B2Feb 27, 2024

Semiconductor device and method of forming the same

MICRON TECHNOLOGY INC1 citations62
US11844208B2Dec 12, 2023

Semiconductor device and method of forming the same

MICRON TECHNOLOGY INC1 citations62
US11785781B2Oct 10, 2023

Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory

MICRON TECHNOLOGY INC0 citations62
US11062989B2Jul 13, 2021

Assemblies which include wordlines over gate electrodes

MICRON TECHNOLOGY INC0 citations62
US11049864B2Jun 29, 2021

Apparatuses including capacitor structures, and related memory devices, electronic systems, and methods

MICRON TECHNOLOGY INC0 citations62
US11037940B2Jun 15, 2021

Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory

MICRON TECHNOLOGY INC0 citations62
US11031374B2Jun 8, 2021

Methods of compensating for misalignment of bonded semiconductor wafers

MICRON TECHNOLOGY INC0 citations62
US10546811B2Jan 28, 2020

Assemblies which include wordlines over gate electrodes

MICRON TECHNOLOGY INC1 citations62
US12057317B2Aug 6, 2024

Conductive layers in memory array region and methods for forming the same

MICRON TECHNOLOGY INC0 citations61
US11569185B2Jan 31, 2023

Semiconductor device and method of forming the same

MICRON TECHNOLOGY INC0 citations57
US11961579B2Apr 16, 2024

Bit line noise suppression and related apparatuses, methods, and computing systems

MICRON TECHNOLOGY INC0 citations52
US10818665B2Oct 27, 2020

Array of recessed access devices and an array of memory cells individually comprising a capacitor and a transistor

MICRON TECHNOLOGY INC0 citations52

NEC CORP

4 patents

SUKEKAWA MITSUNARI

4 patents

ELPIDA MEMORY INC

2 patents

PS4 LUXCO SARL

1 patent