Inventor
SUKEKAWA MITSUNARI
JP45 patents
⚠️ This page may combine multiple inventors who share the name “SUKEKAWA MITSUNARI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
34 patentsUS10103053B1Oct 16, 2018
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC19 citations94
US9666573B1May 30, 2017
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC49 citations94
US9245893B1Jan 26, 2016
Semiconductor constructions having grooves dividing active regions
MICRON TECHNOLOGY INC26 citations94
US10410912B2Sep 10, 2019
Integrated circuitry
MICRON TECHNOLOGY INC6 citations84
US11706909B2Jul 18, 2023
Integrated assemblies comprising memory cells and shielding material between the memory cells
MICRON TECHNOLOGY INC3 citations73
US11171140B2Nov 9, 2021
Semiconductor memory device and method of forming the same
MICRON TECHNOLOGY INC3 citations73
US10910379B2Feb 2, 2021
Integrated assemblies comprising memory cells and shielding material between the memory cells, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC2 citations73
US10868078B2Dec 15, 2020
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC1 citations73
US10867837B2Dec 15, 2020
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC1 citations73
US10861787B1Dec 8, 2020
Memory device with bitline noise suppressing scheme
MICRON TECHNOLOGY INC6 citations73
US10600772B2Mar 24, 2020
Semiconductor memory device having plural chips connected by hybrid bonding method
MICRON TECHNOLOGY INC3 citations73
US10535710B2Jan 14, 2020
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC3 citations73
US10504961B2Dec 10, 2019
Methods of forming integrated circuitry
MICRON TECHNOLOGY INC3 citations73
US10340261B1Jul 2, 2019
Semiconductor memory device having plural chips connected by hybrid bonding method
MICRON TECHNOLOGY INC2 citations73
US11217588B2Jan 4, 2022
Integrated assemblies comprising voids between active regions and conductive shield plates, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC2 citations72
US11139302B2Oct 5, 2021
Integrated assemblies comprising spaces between bitlines and comprising conductive plates operationally proximate the bitlines, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC5 citations72
US12520475B2Jan 6, 2026
Semiconductor memory device and method of forming the same
MICRON TECHNOLOGY INC1 citations64
US11744061B2Aug 29, 2023
Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cells
MICRON TECHNOLOGY INC0 citations63
US11488963B2Nov 1, 2022
Method of forming a semiconductor device
MICRON TECHNOLOGY INC0 citations63
US11177266B2Nov 16, 2021
Array of capacitors, an array of memory cells, a method of forming an array of capacitors, and a method of forming an array of memory cells
MICRON TECHNOLOGY INC0 citations63
US12495535B2Dec 9, 2025
Compact microelectronic 6T SRAM memory devices, and related systems and methods
MICRON TECHNOLOGY INC0 citations62
US11917814B2Feb 27, 2024
Semiconductor device
MICRON TECHNOLOGY INC0 citations62
US11917808B2Feb 27, 2024
Semiconductor device and method of forming the same
MICRON TECHNOLOGY INC1 citations62
US11844208B2Dec 12, 2023
Semiconductor device and method of forming the same
MICRON TECHNOLOGY INC1 citations62
US11785781B2Oct 10, 2023
Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory
MICRON TECHNOLOGY INC0 citations62
US11062989B2Jul 13, 2021
Assemblies which include wordlines over gate electrodes
MICRON TECHNOLOGY INC0 citations62
US11049864B2Jun 29, 2021
Apparatuses including capacitor structures, and related memory devices, electronic systems, and methods
MICRON TECHNOLOGY INC0 citations62
US11037940B2Jun 15, 2021
Integrated circuit constructions comprising memory and methods used in the formation of integrated circuitry comprising memory
MICRON TECHNOLOGY INC0 citations62
US11031374B2Jun 8, 2021
Methods of compensating for misalignment of bonded semiconductor wafers
MICRON TECHNOLOGY INC0 citations62
US10546811B2Jan 28, 2020
Assemblies which include wordlines over gate electrodes
MICRON TECHNOLOGY INC1 citations62
US12057317B2Aug 6, 2024
Conductive layers in memory array region and methods for forming the same
MICRON TECHNOLOGY INC0 citations61
US11569185B2Jan 31, 2023
Semiconductor device and method of forming the same
MICRON TECHNOLOGY INC0 citations57
US11961579B2Apr 16, 2024
Bit line noise suppression and related apparatuses, methods, and computing systems
MICRON TECHNOLOGY INC0 citations52
US10818665B2Oct 27, 2020
Array of recessed access devices and an array of memory cells individually comprising a capacitor and a transistor
MICRON TECHNOLOGY INC0 citations52
NEC CORP
4 patentsUS6309960B1Oct 30, 2001
Method of fabricating a semiconductor device
NEC CORP18 citations84
US6261949B1Jul 17, 2001
Method for manufacturing semiconductor device
NEC CORP15 citations84
US6544840B2Apr 8, 2003
Semiconductor memory device and manufacturing method and mask data preparing method for the same
NEC CORP9 citations74
US6469337B1Oct 22, 2002
Semiconductor memory device and manufacturing method and mask data preparing method for the same
NEC CORP7 citations74
SUKEKAWA MITSUNARI
4 patentsUS8941162B2Jan 27, 2015
Semiconductor device, method for forming the same, and data processing system
SUKEKAWA MITSUNARI7 citations83
US8541316B2Sep 24, 2013
Method of manufacturing semiconductor device including sequentially forming first and second mask material layers and forming a dotted photoresist pattern on the second mask material layer
SUKEKAWA MITSUNARI10 citations83
US8138094B2Mar 20, 2012
Method for manufacturing mask
SUKEKAWA MITSUNARI0 citations51
US8093642B2Jan 10, 2012
Semiconductor memory device and method of manufacturing the same
SUKEKAWA MITSUNARI1 citations51