Inventor

CHAN SHIH-KAI

TW4 patents

⚠️ This page may combine multiple inventors who share the name “CHAN SHIH-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SEMILEDS CORP

3 patents

US11417799B2Aug 16, 2022

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

SEMILEDS CORP4 citations82

US11862755B2Jan 2, 2024

Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate

SEMILEDS CORP0 citations61

US11862754B2Jan 2, 2024

Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate

SEMILEDS CORP0 citations61

TSLC CORP

1 patent

US12426410B2Sep 23, 2025

Semiconductor components and semiconductor structures and methods of fabrication

TSLC CORP0 citations59