Inventor
OHORI Keiji
JP4 patents
⚠️ This page may combine multiple inventors who share the name “OHORI Keiji”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMILEDS CORP
3 patentsUS11417799B2Aug 16, 2022
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP4 citations82
US11862755B2Jan 2, 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP0 citations61
US11862754B2Jan 2, 2024
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
SEMILEDS CORP0 citations61