Inventor
UEDA SHUHEI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “UEDA SHUHEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINETSU CHEMICAL CO
14 patentsUS5866634AFeb 2, 1999
Biodegradable polymer compositions and shrink films
SHINETSU CHEMICAL CO155 citations98
US5726220AMar 10, 1998
Biodegradable polymer compositions and shrink films
SHINETSU CHEMICAL CO78 citations95
US12342467B2Jun 24, 2025
Microstructure-transfer apparatus, stamp head unit, stamp component for transferring microstructure, and method for transferring microstructure-integrated component
SHINETSU CHEMICAL CO1 citations63
US7906256B2Mar 15, 2011
Recycling of large-size photomask substrate
SHINETSU CHEMICAL CO2 citations61
US7745071B2Jun 29, 2010
Large-sized glass substrate
SHINETSU CHEMICAL CO2 citations60
US7608542B2Oct 27, 2009
Large-size glass substrate for photomask and making method, computer-readable recording medium, and mother glass exposure method
SHINETSU CHEMICAL CO4 citations60
US7191618B2Mar 20, 2007
Large-sized substrate and method of producing the same
SHINETSU CHEMICAL CO2 citations60
US7183210B2Feb 27, 2007
Method for preparing large-size substrate
SHINETSU CHEMICAL CO6 citations60
US12421164B2Sep 23, 2025
Substrate for transferring microstructures and method for manufacturing the same
SHINETSU CHEMICAL CO0 citations58
US10281612B2May 7, 2019
Methods for working and sensing synthetic quartz glass substrate
SHINETSU CHEMICAL CO0 citations52
US9599746B2Mar 21, 2017
Methods for working and sensing synthetic quartz glass substrate
SHINETSU CHEMICAL CO0 citations52
US10680139B2Jun 9, 2020
Window member for optical device package, optical device package, making methods, and optical device-mountable package
SHINETSU CHEMICAL CO0 citations51
US10065285B2Sep 4, 2018
Method of preparing substrate
SHINETSU CHEMICAL CO0 citations51
US9919962B2Mar 20, 2018
Polishing agent for synthetic quartz glass substrate
SHINETSU CHEMICAL CO0 citations51
SEMILEDS CORP
3 patentsUS11417799B2Aug 16, 2022
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP4 citations82
US11862755B2Jan 2, 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP0 citations61
US11862754B2Jan 2, 2024
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
SEMILEDS CORP0 citations61