Inventor
OH DONGJOON
KR15 patents
Patents
15 patentsUS11996358B2May 28, 2024
Semiconductor packages having first and second redistribution patterns
SAMSUNG ELECTRONICS CO LTD2 citations72
US11139251B2Oct 5, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations67
US12368093B2Jul 22, 2025
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD0 citations62
US12593702B2Mar 31, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12347760B2Jul 1, 2025
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11923309B2Mar 5, 2024
Semiconductor package including fine redistribution patterns
SAMSUNG ELECTRONICS CO LTD0 citations61
US11798872B2Oct 24, 2023
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12381151B2Aug 5, 2025
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12224256B2Feb 11, 2025
Wafer structure and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US11854893B2Dec 26, 2023
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US11664312B2May 30, 2023
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11652066B2May 16, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations56
US12451474B2Oct 21, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12009288B2Jun 11, 2024
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12456627B2Oct 28, 2025
Dry etching apparatus and wafer etching system using the same
SAMSUNG ELECTRONICS CO LTD0 citations47