Inventor
KWEON JUNYUN
KR12 patents
Patents
12 patentsUS12593702B2Mar 31, 2026
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12347760B2Jul 1, 2025
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11923309B2Mar 5, 2024
Semiconductor package including fine redistribution patterns
SAMSUNG ELECTRONICS CO LTD0 citations61
US11798872B2Oct 24, 2023
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US12224256B2Feb 11, 2025
Wafer structure and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations60
US11854893B2Dec 26, 2023
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations60
US12513973B2Dec 30, 2025
Wafer structure and semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations59
US12009288B2Jun 11, 2024
Interconnection structure and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12588558B2Mar 24, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US12512429B2Dec 30, 2025
Semiconductor device and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12456627B2Oct 28, 2025
Dry etching apparatus and wafer etching system using the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12412824B2Sep 9, 2025
Semiconductor packages and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations47