Inventor
CHEN TING-TING
TW19 patents
Patents
19 patentsUS10950731B1Mar 16, 2021
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD25 citations94
US10727065B2Jul 28, 2020
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9812358B1Nov 7, 2017
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD13 citations83
US11855214B2Dec 26, 2023
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10879111B1Dec 29, 2020
Dielectric plugs
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11688766B2Jun 27, 2023
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11296187B2Apr 5, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12412779B2Sep 9, 2025
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369388B2Jul 22, 2025
Semiconductor devices with tunable low-K inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12336214B2Jun 17, 2025
Inner spacers for gate-all-around semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12324200B2Jun 3, 2025
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094952B2Sep 17, 2024
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11915936B2Feb 27, 2024
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901220B2Feb 13, 2024
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848238B2Dec 19, 2023
Methods for manufacturing semiconductor devices with tunable low-k inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11626482B2Apr 11, 2023
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557483B2Jan 17, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11502166B2Nov 15, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024504B2Jun 1, 2021
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62