Inventor
UENO TETSUJI
TW32 patents
⚠️ This page may combine multiple inventors who share the name “UENO TETSUJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
14 patentsUS7952147B2May 31, 2011
Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same
SAMSUNG ELECTRONICS CO LTD122 citations99
US7361563B2Apr 22, 2008
Methods of fabricating a semiconductor device using a selective epitaxial growth technique
SAMSUNG ELECTRONICS CO LTD94 citations98
US7611951B2Nov 3, 2009
Method of fabricating MOS transistor having epitaxial region
SAMSUNG ELECTRONICS CO LTD9 citations84
US7601983B2Oct 13, 2009
Transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US7611973B2Nov 3, 2009
Methods of selectively forming epitaxial semiconductor layer on single crystalline semiconductor and semiconductor devices fabricated using the same
SAMSUNG ELECTRONICS CO LTD7 citations74
US7791146B2Sep 7, 2010
Semiconductor device including field effect transistor and method of forming the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7776723B2Aug 17, 2010
Method of manufacturing an epitaxial semiconductor substrate and method of manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations63
US7728393B2Jun 1, 2010
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations63
US7714394B2May 11, 2010
CMOS semiconductor devices having elevated source and drain regions and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD6 citations63
US7619285B2Nov 17, 2009
Method of fabricating CMOS transistor and CMOS transistor fabricated thereby
SAMSUNG ELECTRONICS CO LTD4 citations63
US7582535B2Sep 1, 2009
Method of forming MOS transistor having fully silicided metal gate electrode
SAMSUNG ELECTRONICS CO LTD3 citations63
US7439596B2Oct 21, 2008
Transistors for semiconductor device and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US7365010B2Apr 29, 2008
Semiconductor device having carbon-containing metal silicide layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD5 citations62
US7682888B2Mar 23, 2010
Methods of forming NMOS/PMOS transistors with source/drains including strained materials
SAMSUNG ELECTRONICS CO LTD2 citations57
TAIWAN SEMICONDUCTOR MFG CO LTD
14 patentsUS10658468B2May 19, 2020
Epitaxial growth methods and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11688766B2Jun 27, 2023
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11296187B2Apr 5, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12412779B2Sep 9, 2025
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369388B2Jul 22, 2025
Semiconductor devices with tunable low-K inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369374B2Jul 22, 2025
Epitaxial growth methods and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12324200B2Jun 3, 2025
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094952B2Sep 17, 2024
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901220B2Feb 13, 2024
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848238B2Dec 19, 2023
Methods for manufacturing semiconductor devices with tunable low-k inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11626482B2Apr 11, 2023
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11502166B2Nov 15, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11456360B2Sep 27, 2022
Epitaxial growth methods and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10453925B2Oct 22, 2019
Epitaxial growth methods and structures thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52