Inventor
MANDALAPU CHANDRASEKHAR
US11 patents
⚠️ This page may combine multiple inventors who share the name “MANDALAPU CHANDRASEKHAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC
8 patentsUS11791307B2Oct 17, 2023
DBI to SI bonding for simplified handle wafer
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC4 citations85
US11664357B2May 30, 2023
Techniques for joining dissimilar materials in microelectronics
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC15 citations85
US11552041B2Jan 10, 2023
Chemical mechanical polishing for hybrid bonding
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC8 citations85
US12300662B2May 13, 2025
DBI to SI bonding for simplified handle wafer
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC2 citations74
US12564106B2Feb 24, 2026
Techniques for joining dissimilar materials in microelectronics
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12438122B2Oct 7, 2025
DBI to Si bonding for simplified handle wafer
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12381173B2Aug 5, 2025
Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interface
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations62
US12406959B2Sep 2, 2025
Post CMP processing for hybrid bonding
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC0 citations52