Inventor

MITCHELL CRAIG

US93 patents

⚠️ This page may combine multiple inventors who share the name “MITCHELL CRAIG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITCHELL CRAIG

TESSERA INC

Compliant integrated circuit package and method of fabricating the same

Microelectronic encapsulation methods and equipment

Compliant integrated circuit package

Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures

Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures

Method of encapsulating die and chip carrier

Semiconductor chip connection components with adhesives and methods for bonding to the chip

System for encapsulating microelectronic devices

Encapsulant for microelectronic devices

Semiconductor chip connection components with adhesives and methods of making same

Method of mounting a connection component on a semiconductor chip with adhesives

Method of mounting a connection component on a semiconductor chip with adhesives

Multi-function and shielded 3D interconnects

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Simultaneous wafer bonding and interconnect joining

Staged via formation from both sides of chip

Active chip on carrier or laminated chip having microelectronic element embedded therein

Laminated chip having microelectronic element embedded therein

Staged via formation from both sides of chip

OGANESIAN VAGE

Microelectronic elements with post-assembly planarization

Microelectronic elements having metallic pads overlying vias

Active chip on carrier or laminated chip having microelectronic element embedded therein

Microelectronic elements with rear contacts connected with via first or via middle structures

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

Multi-function and shielded 3D interconnects

Carrier structures for microelectronic elements

Staged via formation from both sides of chip

Non-lithographic formation of three-dimensional conductive elements

Chip assembly having via interconnects joined by plating

Compliant interconnects in wafers

Simultaneous wafer bonding and interconnect joining

CAREFUSION 303 INC

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Display screen with graphical user interface for an infusion device

Interface display for infusion module

INVENSAS CORP

Reduced stress TSV and interposer structures

Reduced stress TSV and interposer structures

Warpage balancing in thin packages

Warpage balancing in thin packages

UZOH CYPRIAN

Electrical barrier layers

Reliable packaging and interconnect structures

Connector structures and methods

HABA BELGACEM

Cavities containing multi-wiring structures and devices

Stacked microelectronic assembly having interposer connecting active chips

HONDA MOTOR CO LTD

Vehicle having utility bed and passenger restraint assembly

UZOH CYPRIAN EMEKA

Reduced stress TSV and interposer structures