Inventor

DISTEFANO THOMAS H

US184 patents

⚠️ This page may combine multiple inventors who share the name “DISTEFANO THOMAS H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DISTEFANO THOMAS H

TESSERA INC

Stacked chip assembly

Semiconductor chip assembly with anisotropic conductive adhesive connections

Methods of making semiconductor chip assemblies

Chip with internal signal routing in external element

Microelectronic mounting with multiple lead deformation using restraining straps

Encapsulation of microelectronic assemblies

Method for fabricating microelectronic assemblies

Semiconductor chip package with expander ring and method of making same

Microelectronic mounting with multiple lead deformation using restraining straps

Microelectronic assemblies with multiple leads

Packaged microelectronic elements with enhanced thermal conduction

Flexible connectors for microelectronic elements

Thermally enhanced packaged semiconductor assemblies

Vacuum dispense method for dispensing an encapsulant and machine therefor

Bondable compliant pads for packaging of a semiconductor chip and method therefor

Method of forming compliant microelectronic mounting device

Soldering with resilient contacts

Semiconductor connection components and methods with releasable lead support

Methods of making semiconductor chip assemblies

Compliant integrated circuit package and method of fabricating the same

Methods of making microelectronic assemblies

Methods of making semiconductor chip assemblies

Methods for providing void-free layers for semiconductor assemblies

Microelectronic connector for engaging bump leads

Methods of assembling microelectronic assembly with socket for engaging bump leads

Microelectronic mounting with multiple lead deformation and bonding

Methods of making semiconductor connection components with releasable load support

Method of encapsulating a semiconductor package

Microelectronic encapsulation methods and equipment

Compliant microelectrionic mounting device

Wafer-scale techniques for fabrication of semiconductor chip assemblies

Component for connecting a semiconductor chip to a substrate

Semiconductor chip assemblies, methods of making same and components for same

Method of fabricating compliant interface for semiconductor chip

Soldering with resilient contacts

Method of making multilayer circuit

Semiconductor connection components and methods with releasable lead support

Microelectronic mounting with multiple lead deformation and bonding

Microelectronic bonding with lead motion

Semiconductor connection components and method with releasable lead support

Semiconductor chip assemblies and methods of making same

Semiconductor chip assemblies with face-up mounting and rear-surface connection to substrate

Multi-layer circuit construction methods with customization features

Semiconductor chip assemblies with fan-in leads

Method of fabricating semiconductor chip assemblies

Compliant integrated circuit package

Mounting component with leads having polymeric strips

Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures

Method of manufacturing a plurality of semiconductor packages and the resulting semiconductor package structures

CENTIPEDE SYSTEMS INC

High performance electrical connector