Inventor
HIGASHI MASAHIKO
JP37 patents
⚠️ This page may combine multiple inventors who share the name “HIGASHI MASAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SPANSION LLC
12 patentsUS7253046B2Aug 7, 2007
Semiconductor memory device and manufacturing method thereof
SPANSION LLC45 citations95
US7410857B2Aug 12, 2008
Semiconductor memory device and manufacturing method thereof
SPANSION LLC30 citations92
US8669161B2Mar 11, 2014
Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation process
SPANSION LLC1 citations63
US7820547B2Oct 26, 2010
Flash memory device with word lines of uniform width and method for manufacturing thereof
SPANSION LLC2 citations58
US7626227B2Dec 1, 2009
Semiconductor device with reduced transistor breakdown voltage for preventing substrate junction currents
SPANSION LLC3 citations58
US8610199B2Dec 17, 2013
Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation process
SPANSION LLC0 citations52
US7977189B2Jul 12, 2011
Semiconductor device and method of manufacturing the same
SPANSION LLC0 citations52
US7943982B2May 17, 2011
Semiconductor device having laminated electronic conductor on bit line
SPANSION LLC0 citations52
US7573091B2Aug 11, 2009
Semiconductor device and method of manufacturing the same
SPANSION LLC0 citations52
US7479427B2Jan 20, 2009
Semiconductor device and method of fabrication
SPANSION LLC0 citations52
US7910980B2Mar 22, 2011
Sonos device with insulating storage layer and P-N junction isolation
SPANSION LLC0 citations51
US7736953B2Jun 15, 2010
Semiconductor memory and method of fabricating the same
SPANSION LLC0 citations40
KYOCERA CORP
8 patentsUS6027791AFeb 22, 2000
Structure for mounting a wiring board
KYOCERA CORP57 citations94
US6447888B2Sep 10, 2002
Ceramic wiring board
KYOCERA CORP26 citations92
US6348427B1Feb 19, 2002
High-thermal-expansion glass ceramic sintered product
KYOCERA CORP26 citations92
US5763059AJun 9, 1998
Circuit board
KYOCERA CORP43 citations90
US9786927B2Oct 10, 2017
Conductive member, cell stack, electrochemical module, and electrochemical device
KYOCERA CORP1 citations52
US9325019B2Apr 26, 2016
Composite body, collector member, fuel battery cell device, and fuel battery device
KYOCERA CORP1 citations51
US8703350B2Apr 22, 2014
Heat-resistant alloy member, alloy member for fuel cell, collector member for fuel cell, cell stack, and fuel cell apparatus
KYOCERA CORP0 citations51
US11888198B2Jan 30, 2024
Cell, cell stack device, module, and module housing device
KYOCERA CORP0 citations50
HIGASHI MASAHIKO
5 patentsUS8749012B2Jun 10, 2014
Methods and structures for discharging plasma formed during the fabrication of semiconductor device
HIGASHI MASAHIKO3 citations61
US8404549B2Mar 26, 2013
Fabricating method of mirror bit memory device having split ONO film with top oxide film formed by oxidation process
HIGASHI MASAHIKO2 citations61
US8993189B2Mar 31, 2015
Heat-resistant alloy, alloy member for fuel cell, fuel cell stack device, fuel cell module, and fuel cell device
HIGASHI MASAHIKO3 citations57
US8952536B2Feb 10, 2015
Semiconductor device and method of fabrication
HIGASHI MASAHIKO0 citations51
US8076206B2Dec 13, 2011
Method for manufacturing SONOS flash memory
HIGASHI MASAHIKO0 citations51
TEXAS INSTRUMENTS INC
3 patentsUS5818295AOct 6, 1998
Operational amplifier with stabilized DC operations
TEXAS INSTRUMENTS INC46 citations89
US10581426B1Mar 3, 2020
Source down power FET with integrated temperature sensor
TEXAS INSTRUMENTS INC8 citations79
US10812064B2Oct 20, 2020
Source down power FET with integrated temperature sensor
TEXAS INSTRUMENTS INC0 citations47