Inventor

YOKONO HITOSHI

57 patents

⚠️ This page may combine multiple inventors who share the name “YOKONO HITOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YOKONO HITOSHI

HITACHI LTD

Process for forming thin film

Dynamoelectric machine having coil windings and core encapsulated with resin-filler composition

Process for fabricating an interconnected multilayer board

Interconnected multilayer boards and fabrication processes thereof

Electronic device plated with gold by means of an electroless gold plating solution

Apparatus for testing semiconductor device

Uninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler composition

Multilayer wiring substrate and production thereof

Method and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrate

Heat-resistant silicone block polymer

Electrode material for semi-conductor devices

Composition and process for preparing transparent conducting film

Photosensitive compositions containing polyamides acid with photosensitive groups

Electroless copper plating solution

Electroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the same

Cooling arrangement for semiconductor devices and method of making the same

Process for producing solar cells

Optical fiber connector

Reaction injection molded article with threads and method of molding same

Apparatus for molding plastic

Novel thermosetting resin and a process for producing same

Connector and semiconductor device packages employing the same

Radiation-sensitive poly(amic acid) polymer composition

Photosensitive resin composition and method for forming fine patterns with said composition

Process for producing integral skin polyurethane foam

Process for producing transparent electroconductive film

Process for regenerating chemical copper plating solution

Composition and process for producing transparent conductive film

Liquid crystal display device

Unsaturated polyester resin composition for use in pressure molding

Thermosetting resin compositions prepared from isocyanates and epoxyphenols

Electroless gold plating solution

Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound

Heat insulating case and process for preparing the same

Photosensitive resin composition

Process for forming metallic image

Method of producing a thin film multilayer wiring board

Electroless gold plating solution

Screen for projection television

Process for producing rigid polyurethane foam

Epoxy resin composition having excellent latent hardening characteristics

Electroless gold plating solution and method for plating gold therewith

Semiconductor device

Optical switch

Photo and radiation-sensitive organopolymeric material

Thermosetting resin composition

Method for forming conductor layers and method for fabricating multilayer substrates

Thermosetting resins

NIPPON DENKAI LTD

Copper clad laminate, multilayer printed circuit board and their processing method

HITACHI CONSTRUCTION MACHINERY

Method for assembling flat type plastic multifiber connectors