Inventor
IZUTA GORO
JP4 patents
Patents
4 patentsUS5950908ASep 14, 1999
Solder supplying method, solder supplying apparatus and soldering method
MITSUBISHI ELECTRIC CORP58 citations94
US7361983B2Apr 22, 2008
Semiconductor device and semiconductor assembly module with a gap-controlling lead structure
MITSUBISHI ELECTRIC CORP37 citations91
US5821762AOct 13, 1998
Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
MITSUBISHI ELECTRIC CORP52 citations90
US5609287AMar 11, 1997
Solder material, junctioning method, junction material, and semiconductor device
MITSUBISHI ELECTRIC CORP29 citations90