Inventor

IWASAWA NAOZUMI

JP45 patents

⚠️ This page may combine multiple inventors who share the name “IWASAWA NAOZUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IWASAWA NAOZUMI

KANSAI PAINT CO LTD

Method for forming coating films

Resin compositions and a method of curing the same

Method of forming a cured coating film

Resin compositions and a method of curing the same

Photosensitive compositions containing a polymer with carboxyl and hydroxyphenyl groups, a compound with multiple ethylenic unsaturation and a photo-acid generator

Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method

Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method

Electromagnetic wave reflection-preventing material and electromagnetic wave reflection-preventing method

Photo-crosslinkable resin composition

Colored films for use in vacuum forming

Positive-type photosensitive electrodeposition coating composition containing quinonediazide resin having an anion-forming group and a nitrogen-containing compound and process for producing circuit plate using same

Visible light sensitive electrodeposition coating composition and image-forming method using the same

Positive type anionic electrodeposition photo-resist composition and process for pattern formation using said composition

Resin compositions and a method of curing the same

Water-dispersed coating composition comprising an acrylic graft polymer containing carboxyl groups, hydroxyl and/or amide groups

Processes for pattern formation using photosensitive compositions and liquid development

Positive type electrodeposition photoresist compositions

Resin compositions and a method of curing the same

Method of forming pattern coatings based on a radiation curable composition which contains a resin having both thioether and carboxyl groups

Corrosion preventive resin and photopolymerizable composition incorporating same

Active energy ray-curable unsaturated resin composition

Curable composition

Method of preventing adhesion of organisms

Thermosetting powder coating compositions

Thermosetting acrylic powder coating compositions

Epoxy based photopolymerizable composition

Electrodeposition coating process of photoresist for printed circuit board

Process for preparing thermosetting powder coating composition

Positive-type photosensitive electrodeposition coating composition containing resin having ionic group and modified quinonediazidesulfone unit

Positive-type photosensitive electrodeposition coating composition and process for producing circuit plate

Positive-type photosensitive electrodeposition coating composition with o-quinone diazide sulfonyl amide polymer

Visible radiation sensitive composition containing substituted 3-(benzothiazo-2-yl)-7-diethylaminocoumarin as sensitizers

Electrodeposition coating composition

Process for resist pattern formation using positive electrodeposition photoresist compositions

Process for production of printed circuit board

Curable resin and resin composition curable at low temperature

Thermosetting high solid coating composition

Method for forming electrodeposition coating film

Positive-type photosensitive electrodeposition coating composition and process for producing circuit plate

Process for preparing printed-circuit board

Coating compositions and methods for preventing adhesion of organisms

Coating compositions for preventing adhesion of organisms

Resins with unsaturated carbonyl and hydroxyl groups

Electrodeposition coating composition for use in printed circuit board photo resist

SONY CORP

Water and acid developable photoresist composition exhibiting improved adhesion