Inventor
HAGI KIMIO
JP11 patents
⚠️ This page may combine multiple inventors who share the name “HAGI KIMIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
10 patentsUS5604380AFeb 18, 1997
Semiconductor device having a multilayer interconnection structure
MITSUBISHI ELECTRIC CORP120 citations97
US5565378AOct 15, 1996
Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution
MITSUBISHI ELECTRIC CORP66 citations96
US5341026AAug 23, 1994
Semiconductor device having a titanium and a titanium compound multilayer interconnection structure
MITSUBISHI ELECTRIC CORP110 citations96
US5728630AMar 17, 1998
Method of making a semiconductor device
MITSUBISHI ELECTRIC CORP23 citations92
US5480836AJan 2, 1996
Method of forming an interconnection structure
MITSUBISHI ELECTRIC CORP34 citations91
US5306947AApr 26, 1994
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP32 citations90
US5889330AMar 30, 1999
Semiconductor device whose flattening resin film component has a controlled carbon atom content
MITSUBISHI ELECTRIC CORP18 citations83
US6414395B1Jul 2, 2002
Semiconductor device capable of preventing disconnection in a through hole
MITSUBISHI ELECTRIC CORP19 citations77
US5859478AJan 12, 1999
Semiconductor device including a main alignment mark having peripheral minute alignment marks
MITSUBISHI ELECTRIC CORP12 citations73
US6304001B1Oct 16, 2001
Semiconductor device with alignment mark and manufacturing method thereof
MITSUBISHI ELECTRIC CORP5 citations61