Inventor
DENNISON CHARLES
US41 patents
⚠️ This page may combine multiple inventors who share the name “DENNISON CHARLES”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
26 patentsUS5900660AMay 4, 1999
Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory calls
MICRON TECHNOLOGY INC95 citations99
US5705838AJan 6, 1998
Array of bit line over capacitor array of memory cells
MICRON TECHNOLOGY INC130 citations99
US5624863AApr 29, 1997
Semiconductor processing method of forming complementary N-type doped and P-type doped active regions within a semiconductor substrate
MICRON TECHNOLOGY INC146 citations99
US5605857AFeb 25, 1997
Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
MICRON TECHNOLOGY INC226 citations99
US5206183AApr 27, 1993
Method of forming a bit line over capacitor array of memory cells
MICRON TECHNOLOGY INC144 citations98
US5702990ADec 30, 1997
Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
MICRON TECHNOLOGY INC96 citations97
US6110774AAug 29, 2000
Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
MICRON TECHNOLOGY INC80 citations96
US5719424AFeb 17, 1998
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC59 citations96
US5491356AFeb 13, 1996
Capacitor structures for dynamic random access memory cells
MICRON TECHNOLOGY INC73 citations96
US5411909AMay 2, 1995
Method of forming a planar thin film transistor
MICRON TECHNOLOGY INC56 citations96
US5250457AOct 5, 1993
Method of forming a buried bit line array of memory cells
MICRON TECHNOLOGY INC77 citations96
US6495885B1Dec 17, 2002
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC17 citations93
US6438016B1Aug 20, 2002
Semiconductor memory having dual port cell supporting hidden refresh
MICRON TECHNOLOGY INC33 citations93
US6046472AApr 4, 2000
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC19 citations93
US5970335AOct 19, 1999
Semiconductor processing method of forming complementary n-type doped and p-type doped active regions within a semiconductor substrate
MICRON TECHNOLOGY INC19 citations93
US5844254ADec 1, 1998
Planar thin film transistor structures
MICRON TECHNOLOGY INC33 citations93
US5661045AAug 26, 1997
Method for forming and tailoring the electrical characteristics of semiconductor devices
MICRON TECHNOLOGY INC28 citations93
US5405788AApr 11, 1995
Method for forming and tailoring the electrical characteristics of semiconductor devices
MICRON TECHNOLOGY INC31 citations93
US5100838AMar 31, 1992
Method for forming self-aligned conducting pillars in an (IC) fabrication process
MICRON TECHNOLOGY INC43 citations93
US6159813ADec 12, 2000
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC13 citations82
US6858507B2Feb 22, 2005
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC3 citations74
US6757200B2Jun 29, 2004
Semiconductor memory having dual port cell supporting hidden refresh
MICRON TECHNOLOGY INC6 citations74
US6664600B2Dec 16, 2003
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC5 citations74
US6448141B1Sep 10, 2002
Graded LDD implant process for sub-half-micron MOS devices
MICRON TECHNOLOGY INC6 citations74
US5691547ANov 25, 1997
Planar thin film transistor structures
MICRON TECHNOLOGY INC8 citations74
US6002149ADec 14, 1999
Capacitor structures for memory cells
MICRON TECHNOLOGY INC6 citations63
OVONYX INC
10 patentsUS6696355B2Feb 24, 2004
Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory
OVONYX INC344 citations99
US6646297B2Nov 11, 2003
Lower electrode isolation in a double-wide trench
OVONYX INC192 citations99
US6593176B2Jul 15, 2003
Method for forming phase-change memory bipolar array utilizing a single shallow trench isolation for creating an individual active area region for two memory array elements and one bipolar base contact
OVONYX INC532 citations99
US6534781B2Mar 18, 2003
Phase-change memory bipolar array utilizing a single shallow trench isolation for creating an individual active area region for two memory array elements and one bipolar base contact
OVONYX INC684 citations99
US6869883B2Mar 22, 2005
Forming phase change memories
OVONYX INC40 citations96
US7196351B2Mar 27, 2007
Forming phase change memories
OVONYX INC17 citations93
US6969633B2Nov 29, 2005
Lower electrode isolation in a double-wide trench and method of making same
OVONYX INC33 citations93
US7348620B2Mar 25, 2008
Forming phase change memories
OVONYX INC10 citations84
US7005666B2Feb 28, 2006
Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby
OVONYX INC10 citations74
US8363446B2Jan 29, 2013
Multilevel variable resistance memory cell utilizing crystalline programming states
OVONYX INC4 citations62
INTEL CORP
4 patentsUS6649928B2Nov 18, 2003
Method to selectively remove one side of a conductive bottom electrode of a phase-change memory cell and structure obtained thereby
INTEL CORP199 citations99
US7217945B2May 15, 2007
Method to selectively increase the top resistance of the lower programming electrode in a phase-change memory cell and structures obtained thereby
INTEL CORP15 citations93
US7229887B2Jun 12, 2007
Method to selectively remove one side of a conductive bottom electrode of a phase-change memory cell and structure obtained thereby
INTEL CORP10 citations84
US10877352B2Dec 29, 2020
Semiconductor photonic devices using phase change materials
INTEL CORP2 citations69