Inventor

NGUYEN SON VAN

US76 patents

⚠️ This page may combine multiple inventors who share the name “NGUYEN SON VAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NGUYEN SON VAN

IBM

Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality

Low K and ultra low K SiCOH dielectric films and methods to form the same

Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made

Low k and ultra low k SiCOH dielectric films and methods to form the same

Method for etching boron nitride

Advanced damascene planar stack capacitor fabrication method

Method for reducing film stress for SiCOH low-k dielectric materials

Advanced multilayer dielectric cap with improved mechanical and electrical properties

Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure

Advanced damascene planar stack capacitor fabrication method

Low temperature BPSG deposition process

Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made

Method and apparatus for in-situ monitoring of ion energy distribution for endpoint detection via capacitance measurement

Flowable spin-on insulator

Shrink-wrap collar for DRAM deep trenches

Shrink-wrap collar from DRAM deep trenches

Method of manufacturing high aspect ratio photolithographic features

C-rich carbon boron nitride dielectric films for use in electronic devices

SiCOH dielectric material with improved toughness and improved Si-C bonding

Hardmask for reliability of silicon based dielectrics

Method of manufacturing a current-perpendicular-to-plane magnetoresistive device with oxidized free layer side regions

Ultralow dielectric constant layer with controlled biaxial stress

Chemical mechanical polishing thickness control in magnetic head fabrication

Magnetic recording device having an improved slider

Reactive ion etching of alumina/TiC substrates

Hydrogen-free silicon-based deposited dielectric films for nano device fabrication

Multi component dielectric layer

Method of depositing material into high aspect ratio features

High density plasma surface modification for improving antiwetting properties

Method of etching ceramics of alumina/TiC with high density plasma

APPLIED MATERIALS INC

Method of modifying interlayer adhesion

Dielectric materials to prevent photoresist poisoning

Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication

Side wall passivation films for damascene cu/low k electronic devices

Method of modifying interlayer adhesion

Modulated/composited CVD low-k films with improved mechanical and electrical properties for nanoelectronic devices

Method of forming low dielectric constant porous films

Methods of modifying interlayer adhesion

HITACHI GLOBAL STORAGE TECH

Method of making a perpendicular recording magnetic head pole tip with an etchable adhesion CMP stop layer

Perpendicular recording magnetic head with a write shield magnetically coupled to a first pole piece

Magnetic transducer with a write head having a multi-layer coil

Method of fabricating a magnetic transducer with a write head having a multi-layer coil

Planarized perpendicular pole tip system and method for manufacturing the same

Process for manufacturing a magnetic head coil structure

NGUYEN SON VAN

Interlevel dielectric stack for interconnect structures

C-rich carbon boron nitride dielectric films for use in electronic devices

Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures

SIEMENS AG

Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states

LAM RES CORP

Method for forming semiconductor structure using modulation doped silicate glasses

EDELSTEIN DANIEL C

Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding