P

Inventor

BAUMANN HELMUT

DE20 patents
⚠️ This page may combine multiple inventors who share the name “BAUMANN HELMUT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BOSCH GMBH ROBERT

18 patents
US6106735AAug 22, 2000

Wafer stack and method of producing sensors

BOSCH GMBH ROBERT102 citations97
US5721377AFeb 24, 1998

Angular velocity sensor with built-in limit stops

BOSCH GMBH ROBERT74 citations96
US5629538AMay 13, 1997

Semiconductor sensor having a protective layer

BOSCH GMBH ROBERT53 citations95
US5273939ADec 28, 1993

Method of assembling micromechanical sensors

BOSCH GMBH ROBERT71 citations95
US6360605B1Mar 26, 2002

Micromechanical device

BOSCH GMBH ROBERT73 citations94
US6465854B1Oct 15, 2002

Micromechanical component

BOSCH GMBH ROBERT36 citations92
US6462392B1Oct 8, 2002

Micromechanical cap structure and the respective manufacturing method

BOSCH GMBH ROBERT27 citations92
US5461917AOct 31, 1995

Acceleration sensor

BOSCH GMBH ROBERT23 citations92
US6936902B2Aug 30, 2005

Sensor with at least one micromechanical structure and method for production thereof

BOSCH GMBH ROBERT34 citations91
US5705745AJan 6, 1998

Mass flow sensor

BOSCH GMBH ROBERT51 citations90
US5369060ANov 29, 1994

Method for dicing composite wafers

BOSCH GMBH ROBERT32 citations88
US6204086B1Mar 20, 2001

Method for manufacturing semiconductor components having micromechanical structures

BOSCH GMBH ROBERT9 citations74
US5355569AOct 18, 1994

Method of making sensor

BOSCH GMBH ROBERT16 citations73
US7273764B2Sep 25, 2007

Sensor with at least one micromechanical structure, and method for producing it

BOSCH GMBH ROBERT6 citations72
US5683947ANov 4, 1997

Method for producing a component according to the anodic bonding method and component

BOSCH GMBH ROBERT6 citations62
US6723250B1Apr 20, 2004

Method of producing structured wafers

BOSCH GMBH ROBERT6 citations55
US7834452B2Nov 16, 2010

Device made of single-crystal silicon

BOSCH GMBH ROBERT0 citations51
US6271471B1Aug 7, 2001

Housing for electronic component, and method of producing the same

BOSCH GMBH ROBERT1 citations50

RIEDHAMMER LUDWIG GMBH

1 patent

KAELBERER ARND

1 patent