Inventor

CLOUSER SIDNEY J

US19 patents

⚠️ This page may combine multiple inventors who share the name “CLOUSER SIDNEY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CLOUSER SIDNEY J

GOULD INC

Method for printed circuit board pattern making using selectively etchable metal layers

Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same

Copper foils for printed circuit board applications and procedures and electrolyte bath solutions for electrodepositing the same

Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations

Resistive metal layers and method for making same

Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives

GOULD ELECTRONICS INC

Thin copper on usable carrier and method of forming same

High performance flexible laminate

High fatigue ductility electrodeposited copper foil

Electrodeposited copper foil

Resistor component with multiple layers of resistive material

NIKKO MATERIALS USA INC

Protective coatings for improved tarnish resistance in metal foils

Resistor component with multiple layers of resistive material

Process for manufacturing copper foil on a metal carrier substrate

GA TEK INC

Protective coatings for improved tarnish resistance in metal foils

Anode structure for manufacture of metallic foil

(unassigned)

Copper wire

ELECTROCOPPER PROD LTD

Copper wire and process for making copper wire

MAGMA COPPER CO

Process for making copper foil