Inventor
FAROOQ SHAJI
US40 patents
Patents
40 patentsUS6444496B1Sep 3, 2002
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM123 citations99
US6528145B1Mar 4, 2003
Polymer and ceramic composite electronic substrates
IBM208 citations98
US6333563B1Dec 25, 2001
Electrical interconnection package and method thereof
IBM85 citations97
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US6275381B1Aug 14, 2001
Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
IBM65 citations96
US6235996B1May 22, 2001
Interconnection structure and process module assembly and rework
IBM65 citations96
US6023407AFeb 8, 2000
Structure for a thin film multilayer capacitor
IBM80 citations96
US5968670AOct 19, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with spring
IBM63 citations96
US6297559B1Oct 2, 2001
Structure, materials, and applications of ball grid array interconnections
IBM55 citations95
US6184062B1Feb 6, 2001
Process for forming cone shaped solder for chip interconnection
IBM56 citations94
US5541005AJul 30, 1996
Large ceramic article and method of manufacturing
IBM64 citations94
US5283104AFeb 1, 1994
Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates
IBM80 citations94
US6574859B2Jun 10, 2003
Interconnection process for module assembly and rework
IBM18 citations92
US6461493B1Oct 8, 2002
Decoupling capacitor method and structure using metal based carrier
IBM23 citations92
US6271111B1Aug 7, 2001
High density pluggable connector array and process thereof
IBM19 citations92
US6216324B1Apr 17, 2001
Method for a thin film multilayer capacitor
IBM37 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US5975409ANov 2, 1999
Ceramic ball grid array using in-situ solder stretch
IBM36 citations92
US5964396AOct 12, 1999
Enhanced ceramic ball grid array using in-situ solder stretch with clip
IBM36 citations92
US5284286AFeb 8, 1994
Porous metal block for removing solder or braze from a substate and a process for making the same
IBM31 citations92
US5219520AJun 15, 1993
Process of making a porous metal block for removing solder or braze
IBM24 citations92
US6300164B1Oct 9, 2001
Structure, materials, and methods for socketable ball grid
IBM42 citations91
US6120885ASep 19, 2000
Structure, materials, and methods for socketable ball grid
IBM25 citations91
US5337475AAug 16, 1994
Process for producing ceramic circuit structures having conductive vias
IBM37 citations91
US5073180ADec 17, 1991
Method for forming sealed co-fired glass ceramic structures
IBM42 citations91
US6559527B2May 6, 2003
Process for forming cone shaped solder for chip interconnection
IBM28 citations90
US5787578AAug 4, 1998
Method of selectively depositing a metallic layer on a ceramic substrate
IBM31 citations90
US6124041ASep 26, 2000
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM35 citations89
US5925443AJul 20, 1999
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM14 citations79
US6984792B2Jan 10, 2006
Dielectric interposer for chip to substrate soldering
IBM9 citations74
US5961032AOct 5, 1999
Method of fabrication of a multi-component solder column by blocking a portion of a through hole in a mold
IBM12 citations73
US5532031AJul 2, 1996
I/O pad adhesion layer for a ceramic substrate
IBM17 citations73
US5525761AJun 11, 1996
Copper-based paste containing refractory metal additions for densification control
IBM7 citations73
US5512711AApr 30, 1996
Copper-based paste containing refractory metal additions for densification control
IBM6 citations73
US5935404AAug 10, 1999
Method of performing processes on features with electricity
IBM7 citations71
US5977625ANov 2, 1999
Semiconductor package with low strain seal
IBM2 citations61
US6358439B1Mar 19, 2002
Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
IBM1 citations60
US5985128ANov 16, 1999
Method of performing processes on features with electricity
IBM2 citations60
US5439636AAug 8, 1995
Large ceramic articles and method of manufacturing
IBM4 citations60
US5723905AMar 3, 1998
Semiconductor package with low strain seal
IBM1 citations51