P

Inventor

WEE YOUNG-JIN

KR12 patents

Patents

12 patents
US6333260B1Dec 25, 2001

Semiconductor device having improved metal line structure and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD89 citations97
US6249056B1Jun 19, 2001

Low resistance interconnect for a semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD51 citations94
US6842028B2Jan 11, 2005

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD21 citations92
US6483162B2Nov 19, 2002

Semiconductor device having improved metal line structure and manufacturing method therefor

SAMSUNG ELECTRONICS CO LTD18 citations92
US6004876ADec 21, 1999

Low resistance interconnect for a semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD17 citations90
US7638423B2Dec 29, 2009

Semiconductor device and method of forming wires of semiconductor device

SAMSUNG ELECTRONICS CO LTD8 citations83
US6693446B2Feb 17, 2004

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD18 citations83
US5814556ASep 29, 1998

Method of filling a contact hole in a semiconductor substrate with a metal

SAMSUNG ELECTRONICS CO LTD15 citations73
US7635645B2Dec 22, 2009

Method for forming interconnection line in semiconductor device and interconnection line structure

SAMSUNG ELECTRONICS CO LTD6 citations62
US7192864B2Mar 20, 2007

Method of forming interconnection lines for semiconductor device

SAMSUNG ELECTRONICS CO LTD5 citations62
US6690187B2Feb 10, 2004

Apparatus for testing reliability of interconnection in integrated circuit

SAMSUNG ELECTRONICS CO LTD4 citations62
US7341908B2Mar 11, 2008

Semiconductor device and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD1 citations51