Inventor
SACHDEV KRISHNA GANDHI
US7 patents
Patents
7 patentsUS5773561AJun 30, 1998
Polymer sealants/adhesives and use thereof in electronic package assembly
IBM43 citations92
US6228511B1May 8, 2001
Structure and process for thin film interconnect
IBM38 citations91
US5976710ANov 2, 1999
Low TCE polyimides as improved insulator in multilayer interconnect structures
IBM72 citations90
US6515061B1Feb 4, 2003
Polyester dispersants for high thermal conductivity paste
IBM21 citations88
US6165629ADec 26, 2000
Structure for thin film interconnect
IBM27 citations88
US6114450ASep 5, 2000
Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin
IBM7 citations71
US5955543ASep 21, 1999
Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hydroxystyrene resin
IBM14 citations71