Inventor
KOHARA HIDEKATSU
JP56 patents
⚠️ This page may combine multiple inventors who share the name “KOHARA HIDEKATSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO OHKA KOGYO CO LTD
49 patentsUS4833067AMay 23, 1989
Developing solution for positive-working photoresist comprising tmah and non-ionic surfactant
TOKYO OHKA KOGYO CO LTD75 citations96
US4740451AApr 26, 1988
Photosensitive compositions and a method of patterning using the same
TOKYO OHKA KOGYO CO LTD73 citations96
US4873177AOct 10, 1989
Method for forming a resist pattern on a substrate surface and a scum-remover therefor
TOKYO OHKA KOGYO CO LTD31 citations93
US5601961AFeb 11, 1997
High-sensitivity positive-working photoresist composition
TOKYO OHKA KOGYO CO LTD24 citations92
US4784937ANov 15, 1988
Developing solution for positive-working photoresist comprising a metal ion free organic base and an anionic surfactant
TOKYO OHKA KOGYO CO LTD35 citations92
US4731319AMar 15, 1988
Positive-working naphthoquinone diazide photoresist composition with two cresol novolac resins
TOKYO OHKA KOGYO CO LTD48 citations92
US6517993B2Feb 11, 2003
Copolymer, photoresist composition, and process for forming resist pattern with high aspect ratio
TOKYO OHKA KOGYO CO LTD25 citations90
US4820621AApr 11, 1989
Developer solution for positive-working photoresist compositions comprising a base and a non-ionic surfactant
TOKYO OHKA KOGYO CO LTD40 citations90
US5057397AOct 15, 1991
Electron beam-curable resist composition and method for fine patterning using the same
TOKYO OHKA KOGYO CO LTD20 citations81
US4882260ANov 21, 1989
Positive-working photosensitive quinone diazide composition with alkali insoluble dye and alkali soluble dye
TOKYO OHKA KOGYO CO LTD19 citations81
US6296992B1Oct 2, 2001
Positive photoresist composition and process for forming contact hole
TOKYO OHKA KOGYO CO LTD6 citations74
US6177226B1Jan 23, 2001
Positive photoresist composition and process for forming contact hole
TOKYO OHKA KOGYO CO LTD7 citations74
US6030741AFeb 29, 2000
Positive resist composition
TOKYO OHKA KOGYO CO LTD8 citations74
US5518860AMay 21, 1996
Positive-working quinonediazide photoresist composition containing hydroxyalkyl substituted pyridine compound
TOKYO OHKA KOGYO CO LTD13 citations74
US5498514AMar 12, 1996
Lithographic double-coated patterning plate with undercoat levelling layer
TOKYO OHKA KOGYO CO LTD13 citations74
US5401617AMar 28, 1995
Method for forming positive patterned resist layer on tantalum substrate utilizing quinone diazide composition with aromatic hydroxy additive
TOKYO OHKA KOGYO CO LTD6 citations74
US4985333AJan 15, 1991
Positive-working photosensitive composition with three difference 1,2-naphthoquinone diazide sulfonic acid esters to include the ester of curcumin
TOKYO OHKA KOGYO CO LTD8 citations74
US4804612AFeb 14, 1989
Highly heat-resistant positive-working o-quinone diazide containing photoresist composition with novolac resin made from phenol with ethylenic unsaturation
TOKYO OHKA KOGYO CO LTD17 citations74
US6492085B1Dec 10, 2002
Positive photoresist composition and process and synthesizing polyphenol compound
TOKYO OHKA KOGYO CO LTD10 citations73
US6379859B2Apr 30, 2002
Positive photoresist composition and process for forming resist pattern using same
TOKYO OHKA KOGYO CO LTD12 citations73
US6120969ASep 19, 2000
Polyphenol compound, quinonediazide ester and positive photoresist composition
TOKYO OHKA KOGYO CO LTD14 citations73
US5738968AApr 14, 1998
Positive photoresist composition
TOKYO OHKA KOGYO CO LTD8 citations73
US5604077AFeb 18, 1997
Positive-working photoresist composition comprising a novolac resin made in butyrolactone as a solvent
TOKYO OHKA KOGYO CO LTD11 citations73
US5384228AJan 24, 1995
Alkali-developable positive-working photosensitive resin composition
TOKYO OHKA KOGYO CO LTD8 citations73
US5180653AJan 19, 1993
Electron beam-curable resist composition and method for fine patterning using the same
TOKYO OHKA KOGYO CO LTD10 citations73
US4906549AMar 6, 1990
Positive-working photoresist composition with quinone diazide sulfonic acid ester and novolac made from m-cresol, p-cresol and aliphatic phenol with 2-6 carbon atoms
TOKYO OHKA KOGYO CO LTD15 citations73
US6187500B1Feb 13, 2001
Positive photoresist compositions and multilayer resist materials using same
TOKYO OHKA KOGYO CO LTD13 citations72
US5853948ADec 29, 1998
Positive photoresist compositions and multilayer resist materials using the same
TOKYO OHKA KOGYO CO LTD15 citations72
US5728504AMar 17, 1998
Positive photoresist compositions and multilayer resist materials using the same
TOKYO OHKA KOGYO CO LTD15 citations72
US5576138ANov 19, 1996
Positive-working naphtho quinone diazide sulfonic acid ester photoresist composition containing select combination of additives
TOKYO OHKA KOGYO CO LTD13 citations72
US5501936AMar 26, 1996
Positive-working quinonediazide photoresist composition containing a cyclohexyl-substituted triphenylmethane compound
TOKYO OHKA KOGYO CO LTD15 citations72
US5478692ADec 26, 1995
Positive-working naphthoquinone diazide sulfonic acid ester photoresist composition containing 4,4'-bis(dialkylamino)benzophenone
TOKYO OHKA KOGYO CO LTD13 citations72
US5434031AJul 18, 1995
Positive-working naphthoquinone diazide photoresist composition containing specific hydroxy compound additive
TOKYO OHKA KOGYO CO LTD16 citations72
US5332647AJul 26, 1994
Positive-working quinone diazide composition containing N,N',N"-substituted isocyanurate compound and associated article
TOKYO OHKA KOGYO CO LTD9 citations72
US5702862ADec 30, 1997
Positive photoresist coating solution comprising a mixed solvent of propylene glycol monopropyl ether and 2-heptanone
TOKYO OHKA KOGYO CO LTD6 citations71
US6566031B1May 20, 2003
Positive photoresist composition, substrate with a photosensitive film and process for imaging a resist pattern
TOKYO OHKA KOGYO CO LTD3 citations63
US6406827B2Jun 18, 2002
Positive photoresist composition and process for forming resist pattern
TOKYO OHKA KOGYO CO LTD4 citations63
US6300033B1Oct 9, 2001
Positive photoresist composition and process for forming resist pattern
TOKYO OHKA KOGYO CO LTD6 citations63
US6207340B1Mar 27, 2001
Positive photoresist composition and process for forming contact hole
TOKYO OHKA KOGYO CO LTD4 citations63
US6106994AAug 22, 2000
Production process of polyphenol diesters, and positive photosensitive compositions
TOKYO OHKA KOGYO CO LTD2 citations63
US5599653AFeb 4, 1997
Pattern forming method with selective silylation utilizing lithographic double-coated patterning plate with undercoat levelling layer
TOKYO OHKA KOGYO CO LTD5 citations63
US6312863B1Nov 6, 2001
Positive photoresist composition
TOKYO OHKA KOGYO CO LTD5 citations62
US6127087AOct 3, 2000
Positive photoresist compositions and multilayer resist materials using same
TOKYO OHKA KOGYO CO LTD5 citations62
US6083657AJul 4, 2000
Positive photoresist compositions and a process for producing the same
TOKYO OHKA KOGYO CO LTD2 citations62
US5702861ADec 30, 1997
Positive photoresist composition
TOKYO OHKA KOGYO CO LTD5 citations62
US5401605AMar 28, 1995
Positive working photosensitive resin composition containing 1,2-naphthoquinone diazide esterification product of triphenylmethane compound
TOKYO OHKA KOGYO CO LTD5 citations62
US5281508AJan 25, 1994
Positive-working photoresist containing o-naphthoquinone diazide sulfonic acid ester and novolak resin consisting of 35 to 43% m-cresol and 65 to 57% p-cresol with substantial absence of o-cresol
TOKYO OHKA KOGYO CO LTD4 citations62
US6475694B2Nov 5, 2002
Positive photoresist composition comprising a phenolic compound having both an acid-decomposable group and a naphthoquinonediazide sulfonyl group
TOKYO OHKA KOGYO CO LTD4 citations61
US6939926B2Sep 6, 2005
Phenol novolak resin, production process thereof, and positive photoresist composition using the same
TOKYO OHKA KOGYO CO LTD2 citations60
TOKYO OHKA KOGYA CO LTD
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