Inventor

TOBBEN DIRK

US19 patents

⚠️ This page may combine multiple inventors who share the name “TOBBEN DIRK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOBBEN DIRK

SIEMENS AG

Dual damascene structure

Metalization system having an enhanced thermal conductivity

Planarization of a non-conformal device layer in semiconductor fabrication

Dual damascene process for metal layers and organic intermetal layers

Method for forming metallization in semiconductor devices with a self-planarizing material

Planarization of a non-conformal device layer in semiconductor fabrication

Integrated circuits and manufacturing methods

Method of planarizing the semiconductor structure

Method for forming a structure

Techniques for forming electrically blowable fuses on an integrated circuit

Multi-level conductive structure including low capacitance material

Microstructure and methods for fabricating such structure

INFINEON TECHNOLOGIES CORP

Formation of controlled trench top isolation layers for vertical transistors

Process for manufacture of trench DRAM capacitor buried plates

Formation of controlled trench top isolation layers for vertical transistors

Semiconductor structures and manufacturing methods

INFINEON TECHNOLOGIES AG

Self-aligned metal caps for interlevel metal connections

Method for expanding trenches by an anisotropic wet etch

IBM

Pedestal collar structure for higher charge retention time in trench-type DRAM cells